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Texas Instruments is expanding its low-cost microcontroller development ecosystem with sensor fusion technology. They have unveiled the Sensor Hub BoosterPack for the Tiva C Series TM4C123G LaunchPad at DESIGN West 2013. This new Sensor Hub BoosterPack (BOOSTXL-SENSHUB) is a cost-effective, plug-in daughter card that allows ARM Cortex-M4 MCU developers to create products with up to seven types of motion and environmental sensing capabilities.

Jules Lejeune, Managing Director of the European self-adhesive labelling association FINAT, outlines the extensive opportunities of the technology in labelling alcoholic beverages. I believe that it is to the whisky and brandy distillers of Europe that we, in the self-adhesive label industry, should drink a long toast. They were one of the key early market sectors to realise the potential of our labelling technology – and to adopt it.

As the only tools provider covering the entire range of Renesas’ 8/16/32-bit microcontroller families, IAR Systems is proud to announce full support for the newly introduced RX111 microcontrollers. As a result of IAR Systems’ strategic alliance with Renesas, immediate support for the group is available in the world-leading C/C++ development tool suite IAR Embedded Workbench.

The Bluetooth SIG hosted its inaugural Bluetooth World conference last week in Shanghai, China. The event brought together a record number of industry elite and Bluetooth product innovators – both current and prospective SIG members – to inspire, empower, and teach one another on the bright future of Bluetooth wireless technology.

As more and more companies are gearing up and demonstrating flexible display prototypes (LG, Nokia and earlier this year at CES 2013, Samsung's Youm display are just a few of the latest examples), the need for protection of these new devices that are freed from the constraints of conventional rigid form factors is highlighted once more.

productronica China 2013 and electronica China 2013 closed their doors at Shanghai New International Expo Center on March 21 with 737 exhibitors and 47,287 visitors, 13 percent increase compared to the previous year. The exhibition space has grown from three halls in 2012 to four halls in 2013. With 46,000 square meters, the trade fairs broke the records, increasing by 31 percent.

By Dr Harry Zervos, Senior Technology Analyst, IDTechEx As more and more companies are gearing up and demonstrating flexible display prototypes (LG, Nokia and earlier this year at CES 2013, Samsung’s Youm display are just a few of the latest examples), the need for protection of these new devices that are freed from the constraints of conventional rigid form factors is highlighted once more.

Part 1- of a 4-part video series by TI's Bob Hanrahan kicks off with an overview on testing power supplies.

Jules Lejeune, Managing Director of the European self-adhesive labelling association FINAT, pinpoints the routes to successful growth and profitability Label the future? That is a challenge for the label industry, in the face of the exceptional change that is happening on many fronts.

Nordic Semiconductor today announces from wireless startup 'Open Source RF' – launched on KickStarter.com – the world's first 'Arduino' compatible open-source micro-computer that can communicate wirelessly with any Bluetooth v4.0 (which includes Bluetooth low energy as a hallmark feature) compatible smartphone (including the iPhone 4S/5) or tablet (such as the 3rd and 4th generation iPad or the iPad mini) and is based on a new RFD51822 module...