Search results for "AMD"

andersDX has launched fit-PC3, the latest generation of the award-winning fit-PC family of tiny, robust, fanless, ultra-low-energy compact computers. Now with improved computing power and graphics performance and more standard interfaces than any computer of a similar size, these sleek, rugged and silent PCs are still the most energy-efficient computers in their class.

STMicroelectronics today announced first results of its collaboration with AMD on next-generation graphics for mobile multimedia. ST’s newest mobile application processor, the Nomadik STn8820, integrates AMD’s innovative graphics technology to enable visually rich 2D and 3D applications on mobile handsets. Live demonstrations of ST’s Nomadik graphic capabilities will be presented at the Mobile World Congress 2008 in Barcelona.

Sealevel Systems has announced the Relio R4000 rackmount computer designed for use in space-critical environments. Available with up to a 1.4GHz Intel Pentium M processor, the R4000 offers exceptional performance and unprecedented I/O expansion in a 1.75” high chassis.

Toshiba Corporation, IBM, and AMD have announced that they have together developed a Static Random Access Memory (SRAM) cell that has an area of only 0.128 square micrometers (μm2), the world’s smallest functional SRAM cell that makes use of fin-shaped Field Effect Transistors (FinFETs).

DFI is pleased to announce today a new COM Express Compact module, the OT905-B series, which is one of the few in the industry that is powered by the dual-core AMD Embedded G-series APUs. It is the perfect solution for applications that require low power and significant graphics performance in a small form factor module.

Hoffmann + Krippner has launched a family of IP65/NEMA-rated 10.4-inch touch screen industrial PCs that use the company’s innovative membrane input technology to support cost-effective front panel customisation in order volumes as low as just 20 units.

Mentor Graphics Corporation announced new capabilities in the Tessent TestKompress and the Tessent FastScan tools that enable higher defect coverage and lower defect per million levels for quality-critical applications like military, medical, automotive, and many others. User defined fault models and a new cell-aware ATPG flow together allow customers to target subtle shorts and open defects internal to standard cells that are not adequately det...

Point Grey, a world leader in advanced digital camera products, and AMD, a global semiconductor innovator, jointly demonstrated uncompressed streaming HD video across USB 3.0 during AMD’s A-Series APU official launch event in Seattle.

Super Talent Technolog today announces a new line of 1066 & 1333 MHz, quad-rank registered DDR3 RDIMM modules for servers. Many of today’s new servers support a new 16 core processors and now require a new type of RDIMMs called quad-channel DDR3. On the heels of their single and dual rank RDIMMs,

AMD has revealed that it was selected for an award of $12.6 million for two research projects associated with the U.S. Department of Energy’s Extreme-Scale Computing Research and Development Program, known as “FastForward.” The DOE award provides up to $9.6 million to AMD for processor-related research and up to $3 million for memory-related research.