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Watch Rutronik & Infineon's exciting webinar today at 2:00 p.m. London (GMT +1:00) and discover the power conversion topologies for bidirectional DC charging. In this webinar you will get an overview of the power conversion topologies for bi-directional DC charging and take a closer look at an application example based on Infineon's 50 kW Reference Design.

The TMCS1123EVM evaluation module (EVM) is intended to facilitate rapid, convenient use of the TMCS1123, an isolated Hall-effect precision current sense monitor using an internal ratiometric reference.

ASMPT has presented its die and module bonding platform that can be used in a variety of ways for producing power modules.

Anritsu Corporation has started sales of its AH15199B 140 Gbaud Wideband/High-Output (2 Vpp) Linear Amplifier developed to evaluate optical transmissions devices in the generation of beyond 1 Tera.

Camdenboss’ CVB225 and CVB450 vertical DIN rail enclosures are designed for robust housing of 5 mm pitch terminal blocks in industrial and commercial applications.

Mouser Electronics has released a new eBook in collaboration with Analog Devices (ADI) and Samtec, exploring the challenges and nuances involved in maintaining signal integrity in our connected world.

Mouser Electronics has teamed up with Infineon Technologies to provide the engineering community with a new webinar called "Seamless Integration: Simplifying Secured Matter Compatibility and Security in Matter Designs."

u-blox has strengthened its contribution to the NVIDIA Jetson and NVIDIA DRIVE Hyperion platforms as part of its strategic growth initiative around high-precision positioning within the industrial and automotive markets.

Gallium Nitride (GaN) is presently in a position that will see it, alongside Silicon Carbide (SiC), revolutionise power supply design as a whole, moving away from traditional purely silicon (Si)-based analogue designs. So how is this design revolution happening, and where is GaN having the most impact?

Alphawave Semi has launched the industry's first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.