Search results for "Toshiba"

AMD today announced its collaboration with Microsoft Corp. for more than 125 Windows 8-based PC designs from leading OEMs including ASUS, Dell, Fujitsu, HP, Lenovo, Samsung, Sony, Toshiba and more. With a hardware accelerated user interface, Microsoft and AMD have collaborated to design Windows 8 to unlock the high performance graphics capabilities found in AMD accelerated processing units (APUs) and discrete AMD Radeon graphics processing units ...

Toshiba today announced that it will launch two 2.5-inch form factor Hybrid Drives that bring new levels of high speed read and write performance to notebook and desktop PCs. The new drives, which integrate high capacity hard disk drives and NAND flash memory in a single unit, will be available in two capacities, 1 terabyte*1 and 750 gigabytes*1. Sample shipments started today.

Toshiba has announced a series of low ON-resistance MOSFETs in the new high-performance UDFN6 package. This compact 2x2mm2 LGA package with power dissipation levels of 1Watt enables the combination of high current operation with small footprint that is increasingly demanded in mobile applications. With the features and functionalities added to current handheld devices, battery lifetime and recharging time are of increasing interest.

Le dernier-né des photocoupleurs compacts* de Toshiba Electronics Europe (TEE) répond aux besoins des interfaces numériques haute vitesse en terme de taux de transfert des données, de performance d'isolation et de contraintes d'espace dans des applications industrielles opérant sur des gammes étendues de températures.

The latest compact photocoupler from Toshiba meets the data rate, isolation performance and space requirements of high-speed digital interfaces in industrial applications operating across extended temperature ranges. This latest logic IC coupler for industrial applications reduces power consumption and is compliant with the reinforced insulation class of international safety standards.

Infineon Technologies is global market leader in power semiconductors for the ninth consecutive year. According to the most recent report from IMS Research (an IHS company), Infineon held an 11.9 percent share of the total US Dollar 17.6 billion market for power semiconductors, in 2011.

Toshiba has announced that it can now offer European ASIC customers a flexible process development and foundry manufacturing service built around its 8” (200mm) CMOS wafer fabrication capabilities. The service combines support for special processes, process modifications and bespoke process development with cost-effective medium- and high-volume manufacturing that is backed by a commitment to long-term supply.

Toshiba, Kobe Steel and Keio University have today jointly announced that they have been selected by Japan's Ministry of Environment to develop and verify a hybrid power control system for concentrated solar power, wind turbine and biomass binary power generation.

Toshiba Electronics Europe (TEE) annonce un IGBT avec une diode de recouvrement intégrée, qui offre une tension de blocage de pointe de 1800 V. Référencé GT40WR21, cet IGBT sera parfait pour les designs de chauffage et de cuisson par induction ainsi que pour d'autres applications exigeant une commutation de hautes performances avec des topologies d'onduleurs à résonance.

Toshiba has announced an IGBT with an integrated reverse recovery diode that offers an industry-leading voltage rating of 1800V. The GT40WR21 will be ideal for induction heating and induction cooking designs and other applications demanding high-performance voltage resonator inverter switching.