Search results for "silicon motion"

Mouser Electronics has released a new eBook in collaboration with Analog Devices (ADI), highlighting essential strategies for optimizing power systems.

Navitas has announced it will preview several breakthroughs at electronica 2024 (Hall C 3, booth 129, November 12th- 15th).

At the upcoming electronica trade show in Munich, Infineon will illustrate how its solutions are driving the global trends of decarbonisation and digitalisation.

For the first time, researchers at the University of California, Irvine, alongside international collaborators, have achievedatomic-scale observationsof grain rotation within polycrystalline materials. These materials, fundamental to electronics, aerospace, automotive, and solar technologies, have long intrigued scientists due to their unique structural dynamics.

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: with the use of UV-curable moulding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimises the energy consumption.

Allegro MicroSystems, a pioneer in sensing and power solutions for motion control and energy-efficient systems, will be attending electronica 2024, to showcase its latest innovations in sensing and power.

Semiconductor industry experts will convene at SEMICON Europa 2024,12–15 November 2024 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.

KYOCERA has further developed its high-end ceramic Starceram N3000 P and has launched a new silicon nitride for the functional testing of next-generation microchips.

Infineon has introduced the CoolSiC Schottky diode 2000V G5, the first discrete silicon carbide diode on the market with a breakdown voltage of 2000V.

Researchers from MIT have stumbled upon a unique chain of materials that could enable the3D printingof active electronics. This discovery marks the first successful creation of semiconductor-free, 3D-printed logic gates and resettable fuses.