Search results for "ai edge computing"
RDS announces availability of COM-HPC modules
Review Display Systems (RDS) has introduced two new COM-HPC modules from prominent embedded computing solutions provider, AAEON.
The new 3.5-inch congatec HPC/3.5-Mini carrier board
congatec has presented the first board-level product in its line with its recently introduced aReady. strategy.
Eight cores unlock advanced virtualisation potential
congatec – a provider of embedded and Edge computing technology – presents new rugged SMARC modules based on the Intel Atom x7000RE processor series (codenamed Amston Lake) and the Intel Core i3 processor.
New EU project to develop advanced space satellite navigation
A new project, launched by the EU under the Photonics Partnership and supported by Photonics21, is poised to transform space exploration and autonomous systems with new sensors that use tiny pulses of laser light to improve satellite navigation and earth observation.
STMicroelectronics reveals ST BrightSense image sensor ecosystem
STMicroelectronicshas launched a set of plug-and-play hardware kits, evaluation camera modules, and software designed to streamline development with its ST BrightSense global-shutter image sensors.
element14 webinar: ‘Exploring Arduino’s Pro’s Role in Industry 4.0’
element14 Community, in collaboration with Arduino, is hosting an upcoming webinar titled‘Exploring Arduino’s Pro’s Role in Industry 4.0.’
IBASE showcases MediaTek genio-based Edge AI computer
IBASE Technology, a renowned provider in the design and manufacturing of edge computing solutions,will showcase its MediaTek Genio-based ISR500 rugged Edge AI computer at embedded world 2024, 9–11 April 2024, booth 3-351 in Hall 3.
AMD releases its new Versal Series Gen 2 devices
AMD’s new Versal Series Gen 2 devices are targeting up to 3x higher TOPs-per-watt with next-gen AI engines and upwards of 10x more CPU-based scalar compute than previous gens.
Semiconductor manufacturing: Pre-, post-, and future trends with Rupal Jain
In an industry where the constant push for miniaturisation and enhanced performance shapes the future, the ability for semiconductor manufactures to pivot fast is crucial.
Digi International to unveil Digi ConnectCore at embedded world 2024
Digi International will introduce the Digi ConnectCore MP25 system-on-module (SOM) at embedded world 2024.