Search results for "NTT Corporation"
TDK introduces new stray-field robust 3D-magnetic position sensor
TDK has extended its Micronas 3D HAL-position sensor family with the HAL/HAR 3936, the newest addition to its Hall-effect-based 3D-position sensor portfolio.
Successful superconducting circuit for qubit control
NEC Corporation has announced its involvement in a successful demonstration of a superconducting circuit for qubit control within large-scale quantum computer systems.
World's first 5G communication from altitude of 4km
SKY Perfect JSAT, NTT DOCOMO, the National Institute of Information and Communications Technology (NICT), and Panasonic jointly announced that they have successfully conducted a 5G communication verification test in the 38GHz band from an altitude of approximately 4km using a small Cessna aircraft operated by Kyoritsu Air Survey simulating the eventual use of High-Altitude Platform Stations (HAPS). The demonstration was the first of its kind in t...
Anritsu introduces new analysers
Anritsu Corporation is pleased to introduce its latest advancements in field testing equipment: the Site Master MS2085A Cable and Antenna Analyser and the MS2089A with Integrated Spectrum Analyser.
OMRON will start providing PCF calculations based on global standards
OMRON Corporation will begin providing carbon footprint data of products (PCF) calculations based on global standards for high-capacity power relays for energy storage systems and other new equipment to customers from May 2024.
Indium Corporation sustainability focus at PCIM
Indium Corporation will showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
Powercast joins RAIN Alliance Sustainability Workgroup
Powercast has announced that it has joined RAIN RFID Alliance’s Sustainability Working Group.
KYZEN to showcase advanced packaging solutions at PCIM
KYZEN, a global specialist in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in PCIM Europe 2024, scheduled to take place 11–13 June 2024 in Nuremberg, Germany.
Indium to present on alternative solder alloys at SMTA
Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on 16thMay 2024 in Aurora, Colorado.
Indium experts will present at Electronics in Harsh Environments Conference
Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East at Indium Corporation, will deliver a technical presentation, while Dr. Ronald Lasky, Senior Technologist, will lead both a workshop and a technical presentation at the Electronics in Harsh Environments SMTA Conference from May 14 to 16 in Copenhagen, Denmark.