Search results for "Master Bond"
Adeia finds increase in demand for AI chipsets
Adeia research has found an increased demand for AI chipsets which will spur requirements for hybrid bonding technology across the semiconductor industry.
ASMPT unveil one of its most advanced die bonding systems
ASMPT has unveiled the new version of the AMICRA NOVA Pro in Munich on 17th January 2024. This state-of-the-art platform merges high placement accuracy with swift cycle times and cutting-edge bonding technologies, marking a significant advancement in the field.
Tascam multifunctional mixing amplifier commercial series
Tascam has introduced the MA-BT240 Multifunctional Mixing Amplifier, which is part of the company’s new Compact Commercial Series.
Indium Corporation expert to present at Power Device & Module Expo at NEPCON
Indium Corporation Senior Area Technical Manager Jason Chou is set to deliver a presentation at the Power Device & Module Expo, held in conjunction with NEPCON Japan, on January 24th in Tokyo.
Understanding I3C (Improved Inter-Integrated Circuit) Bus
In the realm of embedded systems and device communication, the Improved Inter-Integrated Circuit (I3C) bus protocol stands out as a significant advancement.
Beyond the chip: component packaging in next-gen electronic designs
Semiconductor manufacturers are continuously pushing the boundaries of their process technologies to enable designers, in turn, to explore the limits of existing circuit topologies while also developing new ones.
The role of precision time protocol synchronisation in Ethernet cameras
Ethernet cameras rely on precise timing and synchronization for accurate data transmission. The Precision Time Protocol (PTP) ensures sub-microsecond accuracy, synchronizing time clocks among IP-connected devices.
Pico launches oscilloscope training and demo board
Pico Technology, a pioneer in test and measurement solutions, introduces its Oscilloscope Training and Demo Board, a versatile tool designed to elevate and enhance the user experience with (mixed signal) oscilloscopes.
Dynisma chooses PTC for Bristol Tech Campus boost
A South West engineer is helping the world’s best Formula 1 and motorsport teams shave valuable milliseconds off their lap times, while also enabling automotive manufacturers to develop new vehicles more efficiently.
Lumus wins ‘ Next Big Things in Tech’
Lumus, the pioneering developer of reflective waveguide technology for augmented reality (AR) eyewear, has announced that its Z-Lens 2D waveguide architecture has been named to Fast Company’s third annual Next Big Things in Tech list.