Search results for "siemens"
International Conference on Next Generation Networks & Basestations tackles goes ‘Green’
Prominent speakers from leading operators Vodafone, NTT DoCoMo, Telefonica 02, Teliasonera, BT (British Telecom), T-Mobile, Telecom Italia, Carphone Warehouse will share a platform with Industry Analysts from Deloitte, Yankee Group, ABI Research, Cartagena, Arete, Deutsche Bank, Frost & Sullivan and major network vendors Nokia Siemens Networks, ZTE, Huawei, Ericsson, Qualcomm, Motorola, Alcatel-Lucent, at the annual NGN & Basestations Conference ...
ESCATEC adds two new Business Development Managers
ESCATEC has expanded its Business Development team with the addition of two new key recruits. Harald Schroeder is the Business Development Manager for Germany and Austria, and is located in Munich in Southern Germany. Harald started his career in international sales at Deutsch Telekom, before working in account management at Siemens Business Services. He then moved into the EMS industry and spent a number of years working in business develop...
American Superconductor, Nexans and Siemens Successfully Test High Voltage System
Nexans, Siemens and American Superconductor Corporation announced the successful qualification of a transmission voltage resistive fault current limiter that utilizes high temperature superconductor (HTS) wire. This marks the first time a resistive superconductor FCL has been developed and successfully tested for power levels suitable for application in the transmission grid (138 kV insulation class and nominal current of 900 A).
RS increases wireless products with latest technology
With the latest refresh of its Wireless Technology Solutions portfolio, RS Components (rswww.com), the leading distributor of electronic, electrical, electromechanical and industrial components is now able to offer customers the widest range of antennas currently available in the market.
German Research Project V3DIM Lays the Foundations in 3D Design for the Extremely High Frequency Millimeter-Wave Range
The “V3DIM” research project lays the foundations for working out the design requirements to develop innovative, highly integrated 3D System-in-Package (SiP) solutions for systems in the extremely high frequency range of 40 to 100 GHz, the so-called millimeter-wave range.
Telemis announces PACS integration with 3D post-processing imaging software from leading vendors
Telemis Group, the medical imaging company specialized in PACS (Picture Archiving and Communication System) solutions, has unlocked new freedoms for healthcare authorities to combine efficient image-management using the Telemis-Medical PACS with best-in-class visualization and workflow software from all major vendors.
10 years of Swissbit, 20 years of experience
Swissbit AG celebrates its 10th jubilee and can look back on 20 years of experience. Founded in 2001 as the result of a management buy-out from Siemens AG, Swissbit has continually expanded its market position since then, and is now Europe’s largest independent producer of DRAM and NAND Flash-based storage products for the global industrial market.
New Luminescent Material for Warm LED Light
Researchers from Siemens Corporate Technology and Osram have discovered a new dark red luminescent material for light-emitting diodes. This was made possible by the use of a material develop-ment method known as High Throughput Experimentation (HTE), which allows the screening of large composition areas of complex material systems. The new luminescent material can be used, for example, for warm-toned white LEDs for general lighting, for backlight...
Autotech invests further in robotic simulation
Control systems specialist, Autotech Controls Ltd, has expanded its robotic simulation and virtual manufacturing services with an investment of approximately £375,000 in new software and hardware.
NEC Electronics Europe secures automation award nominated IO-Link design at Siemens
NEC Electronics Europe today announced that its IO-Link chip will be powering the communication channel for Siemens’ SIMATIC PX130C intelligent sensor adaptor. The PX130C allows for the pre-processing of standard sensor signals and converts them to the IO-Link standard.