Search results for "Master Bond"
New infrastructure education programme announced
Bentley Systems hasannounced the Bentley Education program, which encourages the development of future infrastructure professionals for careers in engineering, design, and architecture.The Bentley Education program is initially available in the United Kingdom, Australia, Singapore, Ireland, and Lithuania, with plans to expand to the United States, Canada, Mexico, Latin America, and India by mid-summer.
Born2Bond Light Lock low-odour curable CA
Intertronics has launchedBorn2Bond Light Lock, a low-odour, low bloom, dual-curing cyanoacrylate adhesive (CA). Designed for a wide range of bonding applications that require fast fixture, coating or surface cure, Light Lock’s dual cure formulation includes both instant (surface) cure and light cure. It is available in high viscosity and gel formulations for bonding, repair, coating or infilling applications.
UTAC's Cu clip shipments surpass one billion units
UTAC Holdings has underlined its strength in advanced packaging solutions with a commercial achievement. The company has now shipped a total of one billion devices with packages that feature Cu clip (copper) technology.
Practical testing for a productive process
Up front evaluation of the performance of materials and equipment for a manufacturing process to establish how they will perform in the real world can greatly reduce the risk of problems later down the line. One of the steppingstones to productivity is a simple, efficient and error free process when first setting up the production. Here Kevin Cook, Technical Manager at adhesives specialistIntertronics, has discussed how practical testing can giv...
ACEINNA appoints VP of marketing & product development
ACEINNA has appointed Teoman Ustun as the company’s new Vice President of Marketing and Product Development, effective immediately. ACEINNA primarily focuses on developing and manufacturing innovative MEMS sensor and sensing systems solutions for autonomous vehicle navigation, ADAS and industrial applications.
Half bridge driver optimised for asymmetrical topologies
STMicroelectronics has extended the MasterGaN family with the introduction of a high power density 600V half bridge driver with two enhancement mode GaN devices optimised for asymmetrical topologies.
Choosing Flash storage for harsh environments
Flash memory has become the favoured non-volatile bulk storage medium for embedded applications for good reasons. Flash memory is compact, provides long-term reliable data storage that, if the right form is chosen, is able to operate over a wide temperature range and handle conditions such as shock and vibration more readily than rotating disk media. By Victor Tsai, Director of Flash Products, SMART Modular Technologies
I3C portfolio qualified on AMI Firmware platform
Renesas Electronics hasannounced that AMI, a firmware and software solutions partner, has qualified the Renesas I3C bus extension products for its MegaRAC SP-X Remote Management Firmware. Having the I3C devices on AMI’s approved vendor list enables an easy migration path for customers shifting their DDR5 platforms and boards from I2C or other legacy expansion specifications to the new high-speed I3C specification.
MIKROE celebrates 1000th Click board with EtherCAT Click
MikroElektronika (MIKROE) has announced the launch of its 1,000th Click board,EtherCAT Click, which enables EtherCAT functionality to be cost-effectively delivered on various processors over the SPI interface.
Top 5 power products in April
Electronic Specifier takes a look at the top power products to have been released in April.