Search results for "tvs array"
Seeing Machines, Ambarella & Autobrains offer combined front ADAS & driver monitoring solution
Autobrains Technologies, Ambarella and Seeing Machines have announced a strategic collaboration to offer three safety systems in a single box, using a single system-on-chip (SoC).
MediaTek introduces ecosystem of consumer-ready Wi-Fi 7 products at CES 2023
MediaTek will be demonstrating a full ecosystem of production-ready devices featuring the next generation of wireless connectivity at CES 2023.
Weebit Nano tapes-out first 22nm demo chip
Weebit Nano Limited, a developer of next-gen memory technologies for the global semiconductor industry, has taped-out (released to manufacturing) demonstration chips integrating its embedded Resistive Random-Access Memory (ReRAM) module in an advanced 22nm FD-SOI (fully depleted silicon on insulator) process technology.
Nokia and UR Group to deliver 5G industrial solutions
Nokia and UR Group (UK) plan to use the former's private wireless networks and its fully integrated Edge-to-Cloud offerings, as well as the latter's vertical market expertise, to enable transportation, manufacturing, defence and energy organisations to transform their operations with 5G.
Going Green? With Solar Power Encoders for Accurate Positioning and Tracking
Broadcom encoders are ideal for position sensing, motion control and motor feedback in an array of green applications e.g. solar. Incremental encoders are also used for speed control of servo motors. Absolute encoders are an ideal solution for monitoring the panel position to adapt to optimum sunlight direction & conditions. Increase efficiency with Broadcom encoders!
Farnell marks 25 years of success with Bourns
Farnell, an Avnet Company and global distributor of electronic components, products and solutions, celebrates a 25-year long partnership with Bourns, during which they have created a growing demand for Bourns’ products that continue to meet the design requirements of their mutual customers.
Codasip joins OpenHW Group for RISC-V verification
Codasip has joined OpenHW Group. Together with the existing OpenHW ecosystem, Codasip will contribute to the development of standards across various techniques including formal verification. Codasip will contribute supporting IP, tools, and methodologies to help the wider community benefit from its experience in the development of high-quality, standard and customised RISC-V cores.
SABIC’s resin supports shift from pluggable to co-packaged optics
SABIC, a global specialist in the chemical industry, is launching at the ECOC Exhibition 2022 its EXTEM RH1016UCL resin. A high-heat, near-infrared (IR)-transparent grade, well-suited for injection-moulded lenses used in co-packaged optical transceivers and other optical connectors.
New Yorker, World Products ink distribution pact
New Yorker Electronics has sealed a distribution franchise agreement with World Products (WPI), a manufacturer of Thermally Protected MOV's, MOVs, Gas Discharge Tubes, TVS Diodes, Relays and Antennas.
Indium Corporation to feature products for HIA and SiP at IMAPS Boston
Specialist in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications.