Search results for "microelectronics"
EU funded microelectronics project launched to enhance lithography-based yield
Supported by funding from the European Union’s Seventh Framework Programme, a consortium of eight leading institutions has launched a joint microelectronics research project aiming to develop innovative design methods and related EDA tools which remove the limitations in physical implementation effectiveness associated with technology scaling and advanced sub-wavelength lithography. The Synaptic consortium is composed of eight leading instituti...
iPower Event Announces A “Call-For-Papers”
The UK Microelectronics Packaging Society (IMAPS-UK) has announced a call for papers and abstracts for their forthcoming “iPower” event which is intended to ‘Showcase UK Power Electronics’. The event will be held on 30 November & 1 December 2011 at the University of Warwick’s prestigious IDL Conference Centre.
Basic Packaging Workshop - Event Details Announced
UK Microelectronics Packaging Society (IMAPS-UK) is pleased to announce details its forthcoming “Basic Packaging Workshop being held at TWI (The Welding Institute) on 21 & 22 June 2011.
UMC Uses Silicon Frontline’s Field Solver to Generate Reference Extraction Data
Silicon Frontline Technology, Inc. (SFT) announced today that its 3D extraction software for post-layout verification F3D (Fast 3D) has been qualified by United Microelectronics Corporation (NYSE: UMC, TSE: 2303) (UMC), a leading global semiconductor foundry, as the reference field solver for parasitic extraction.
RELY Research Project: New Ways of Chip Design Methodology
Germany’s foreign trade success is determined to an ever-increasing degree by the quality and reliability of high-tech products. Seven partners from the German business and research communities are teaming up in the three-year “RELY” project to explore ways of enhancing the quality, reliability and resilience of modern microelectronic systems. The focus will be on applications in transportation, in particular electromobility, in medical tec...
Sharp presents a new generation of its Mini Zenigata LEDs
The new product generation is again based on a small plate made of technical ceramics (aluminium oxide Al2O3) with the dimensions 15mm x 12mm x 1.6mm. Efficiency was able to be improved by up to 11% due to technical progress. The new generation of 4 and 7W arrays is characterised by four properties: Compact, light, economical and noticeably brighter than before.
An introduction to safety engineering
A new hard-backed book on safety engineering is available from Euchner, providing nearly 200 pages of useful information for process and production engineers covering the planning, development and construction of safety systems for machine based operations.
SmartKem Launches New Website Showcasing Innovative SmartKem Technique for Printed Electronics
SmartKem Ltd, the developer of novel materials and processes that create high resolution microelectronic components directly onto thin flexible materials, today announces the launch of its new website - www.smartkem.com. The easy-to-navigate website offers quick access to information about the innovative SmartKem technique, which is set to revolutionise the rapidly growing printed electronics industry and overcome challenges associated with other...
See STI Electronics’ Engineering Services Division at Lockheed Martin LM Connect 2010
STI Electronics, Inc., will feature its key engineering services at the upcoming Lockheed Martin LM Connect Conference, scheduled to take place November 1-4, 2010 in Orlando, FL.
Meet Kyzen’s Experts at the SMTA Penang Vendor Show
Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Chris Harvey, Asia Pacific Technical Manager, will present “Lead-Free No-Clean Soldering Materials Increase the Cleaning Challenge” at the upcoming SMTA Penang Vendor Show, scheduled to take place November 19, 2010 at the Eastin Hotel in Penang, Malaysia.