Search results for "geometry"
ITI TranscenData Releases Proficiency 8.1
ITI TranscenData announced today the release of Proficiency Collaboration Gateway 8.1, the latest edition of its leading Feature Based CAD Interoperability solution for manufacturers and their suppliers. Collaboration Gateway enables the transfer of complete design intelligence between major CAD systems which includes geometry, features, sketches, manufacturing info, metadata, assembly information and drawings in the conversion process.
NOVEL LAPPING MACHINE USES RUBBER AND DIAMOND TO FINE-POLISH
A new lapping machine has been introduced by Japanese grinding machine manufacturer, Okamoto, in which it is possible to achieve a mirror finish on any surface, including uneven profiles, in a three- to five-minute cycle. Sole UK agent is NCMT.
ANSYS 12.1 Enhancements Support Fast Product Design and Validation
ANSYS, Inc. , announced the availability of ANSYS(R) 12.1 technology to support customers in Simulation Driven Product Development. This latest release incorporates tools that further automate the product development process, making it easier to create designs that will succeed in the marketplace. In addition, ANSYS 12.1 extends the integration of its products with several best-in-class industry applications -- for electronics, polymer and glass-...
Tata Motors Chooses ESI's Sheet Metal Forming Simulation Software To Reduce Noise
Based on a Noise-Vibration-Harshness (NVH) study showing that maximum engine noise comes from the oil sump, Tata Motors, India's largest automotive company, selected PAM-STAMP 2G, ESI’s Sheet Metal Forming Simulation Suite, to investigate and then completely redefine and optimize its oil sump concept.
Fast, automated health check for multi-axis machine tools
Renishaw's AxiSet Check-Up is a cost-effective solution for checking the alignment and positioning performance of rotary axes. In just a few minutes, users of five-axis machining centres and multi-tasking mill-turn machines can identify and report on poor machine alignments and geometry that can cause extended process setting times, as well as non-conforming parts. The latest release is now available, offering significant new benefits to users.
Imagination demonstrates latest Stereoscopic 3D (S3D) graphics and display technologies
Imagination Technologies Group plc (LSE: IMG; Imagination), a leading multimedia and communications chip technologies company, is demonstrating implementations of its licensable 3D, Video and Display IP technologies capable of delivering immersive stereoscopic 3D (S3D) experiences.
Synopsys' LightTools Delivers Leading-Edge Illumination Analysis
Synopsys announced the availability of enhancements to its LightTools illumination design and analysis software, acquired as part of Synopsys' acquisition of Optical Research Associates (ORA). LightTools 7.2 delivers features that will help users graphically analyze simulation results, compute important metrics when designing for the lighting industry, iteratively design with CAD software and improve the efficiency of luminaire and solar designs....
CST Previews New Tool for Multi-Physics Simulation at EuMW 2009
In many branches of microwaves and RF engineering, required analysis is not confined to the electromagnetic problem, particularly when dealing with high power applications. Both the temperature rise and resulting stress have to be considered in the design process since these may have major implications for the device’s performance.
Delphi Presents Latest Technology for Agricultural Vehicle Industry
As a supplier in the agricultural sector, Delphi Automotive offers its expertise as a high-tech partner in powertrain, thermal, electric and electronic architecture technologies and as a systems integrator. Delphi is applying its proven expertise with automobiles and commercial vehicles to develop rugged, reliable and durable products for the agricultural and construction vehicle industries.
Infineon Introduces Automotive Qualified 100 Percent Lead-free Power MOSFETs in Standard TO Package Types
Infineon Technologies AG today introduced automotive qualified 100 percent lead-free power MOSFETs for TO package types. Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS T2 power MOSFETs offer best-in-class specifications. Infineon uses a diffusion soldering die attach approach to produce the lead-free packages that include TO-220, TO-262 and TO-263. Because of specifi...