Search results for "KIC"
3D printing & cyber security on IOM Conference agenda
This year’s IOM (Institute of Operations Management) conference took place at Ettington Chase, Stratford-upon-Avon, where delegates were invited to participate in IOM’s first-ever interactive conference. The theme of the conference was ‘Plan and Take Control’ and the jam-packed itinerary included speakers from Rolls-Royce, Lego Ltd, Fujitsu and Hughenden Consulting as well as new innovative concepts such as IOM’s Wor...
electronica plays host to TI's Innovation Challenge
Today, at electronica (14th November), the results of the Texas Instruments Innovation Challenge - Europe Analog Design Contest 2014 were announced. The presentation also featured speeches from previous TIIC winner, Hans De Clercq, TI representative Steve Lyle, and co-sponsor Mouser Electronics' Mark Burr-Lonnon.
Products that enable a more connected world are showcased
NXP Semiconductors has announced that it will introduce and demonstrate its most recent solutions and share the latest product updates in A4.524 at electronica A4.524. Whether the solution is designed for mobile phones, the connected car, IoT or within the portable and wearable domain, NXP plays a major role in this evolution, powering the technology that enables secure connections for a smarter, more connected world.
Evaluation kit allows for simple industrial Ethernet setup
Renesas has announced the availability of its 'Connect it! - Ethernet R-IN Solution Kit', an evaluation tool for industrial Ethernet networking. The kit, based on IAR’s KickStart Kit for Renesas’ R-IN32M3-EC industrial Ethernet communication chip, includes all the hardware and software components system manufacturers need to set up industrial Ethernet slave networks.
EVM enables HD projection in compact electronics
The DLP LightCrafter Display 3010 EVM (Evaluation Module) is Texas Instruments' latest developer tool which enables quick assessment of the DLP 0.3” (7.62mm) TRP HD 720p video and data display chipset. The chipset is comprised of a DLP3010 Digital Micromirror Device (DMD), a DLPC3433 or DLPC3438 display controller and a DLPA2005 LED driver for power management
America's Got Talent host will appear at 2015 CES
Entrepreneur, actor and record producer Nick Cannon will serve as the Entertainment Matters Ambassador for the 2015 International CES, the CEA (Consumer Electronics Association) has announced. Sponsored by Variety, Entertainment Matters is a content-focused CES program developed for Hollywood’s film, television and digital communities.
New recruits spearhead Midas Displays growth push
Midas Displays has strengthened its sales and management team to prepare for the next phase in its expansion plans. Industry veterans Mike Fowle and Chris Parr have been recruited as Business Development Managers to pursue opportunities with new and existing customers. Fowle joins Midas with over 25 years industry experience. He brings a wealth of knowledge for displays and system solutions including touch-screen and bonding technology, and will ...
1A µDC/DC converter with integrated coil minimises radiated noise
The XCL219/XCL220 modulefrom Torex Semiconductor is designed to minimise unwanted radiated noise or EMI, making it suitable for sensitive RF applications. With its integrated coil, the XCL219/220 achieves a significant reduction in radiated noise across all frequency bands, when compared with a conventional DC/DC circuit with an external coil.
One week to discover the UK’s most exciting tech start-ups
In just over a week 18 UK tech start-ups take the stage to pitch their ideas to the likes of Google, Qualcomm Ventures, Orange Labs, IBM and London Business Angels in the Discovering Start-ups 2014 (DS14) final. Jointly delivered by Cambridge Wireless (CW) and SETsquared, the DS14 national competition has attracted entrants from UK tech clusters and will culminate in a pitching final on the 22nd October at the Deloitte’s London offices.
ADLINK, Intel kick off joint technology strategy
ADLINK Technology has allied with Intel to create a demo room at ADLINK's Shanghai Operations Center as the kick-off event for a newly-signed collaborative technology strategy. The cooperation has been formed to deliver advanced, cutting-edge switching, transcoding, and deep packet inspection solutions for the next iteration of the intelligent edgecloud computing platform.