Search results for "photon chips"
CSR launches µEnergy™ platform for ultra low power connected devices
CSR today announced the launch of its first single-mode, single-chip Bluetooth low energy platform, CSR µEnergy, addressing the needs of ultra low power connected devices. The CSR µEnergy platform will provide everything required to create a Bluetooth low energy product with RF, baseband, microcontroller, qualified Bluetooth v4.0 stack, and customer application running on a single chip. The CSR µEnergy Bluetooth low energy platform will enable...
Conduction Cooling Augments Legacy PC/104 Market
Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and expansion modules for real-world applications, launched today at the Intel Developer Forum (IDF) the Aurora single board computer (SBC) as a much-needed technological breakthrough in small form factor (SFF) embedded computing. Featuring the 1.6GHz AtomTM Z530 processor from Intel, Aurora combines US-based rugged design know-how with advanced manufacturing pr...
C-MAC MicroTechnology announces further development of high temperature DC-DC converters
C-MAC MicroTechnology today announced it has extended its agreement with CISSOID to integrate Vesuvio™ technology into high temperature DC-DC converter designs featuring their latest Magma and Hyperion semiconductor devices. Following on from the successful 20 Watt module based around the original ETNA chip set, these new state-of-the-art modules offer further improvements in efficiency and packaging density and provide multiple output voltage...
COMPRION premieres the first universal conformance platform for terminal testing at the Mobile World Congress
The UT³ Platform is COMPRION’s conformance platform for testing according to the requirements of GCF/PTCRB (listed as test platform TP 118) and the NFC Forum. As a test system supporting all the contact-based and contactless smart card interfaces - be it ISO/IEC 7816, SWP/HCI, IC- USB or NFC - the UT³ Platform is the right solution for testing mobile phones, contactless terminals, chipsets, NFC chips, NFC devices, M2M modules or laptops.
Everlight Electronics - High Voltage LED Series for Retrofit Lighting Applications
Everlight Electronics Co launches a range of High Voltage LEDs especially suited for use in solid state lighting integral lamps, aka retrofit lamps. Everlight's new HiVo series comprises a 1W, 2W and 4W solution. The single chip LED provides a luminous flux of 80 / 100 lm at 48-55VDC in a color temperature of 3000 / 5700 K. The 2W product with two LED chips connected in series achieves 140 lm for 2700 K at 95-111VDC. The 4 chip LED with 275 / 37...
Everlight Electronics, TPV and Epistar Partner to Address the Rapidly Changing Future Demands of the Worldwide LED Backlighting Market
Everlight Electronics, a leading LED packaging house and LED technology provider, TPV Technology Limited (TPV), the world's largest PC monitor manufacturer and LCD TV ODM company, and Epistar Corporation, the world's largest LED chips provider, today announced the establishment of a new joint venture to develop and produce LED packages and LED light bars for the LED backlight market.
EMCCD cameras available from Raptor Photonics
Alrad Imaging has announced Raptor Photonics now offer a newEMCCD camera Merlin EMCCD Camera with a CameraLink or GigE output. The ME247-CL (monochrome) and ME246-CL (colour) cameras offer a standard CameraLink output inside a compact housing, designed for demanding security, industrial or scientific applications. In order to support GigE output, Raptor also offers a standard adaptor box from Pleora, which converts CameraLink data to GigE data.
Intel Atom Power in a PC/104 Form Factor
Impulse has announced that AAEON Technology, has launched a brand new PC/104 CPU module – the PFM-945C. The special characteristics of this PC/104 module are the onboard PCI/104-Express function offering the latest options in expansion capabilities in the embedded market.
Icera and Rohde & Schwarz team up on LTE
Icera, Bristol UK, and Rohde & Schwarz, Munich Germany, today announced that they are working together on Rohde & Schwarz's LTE protocol conformance test program to enable the wireless industry to certify and deploy LTE technology successfully and more quickly. Both Icera and Rohde & Schwarz are industry leaders in the development of multimode LTE products. Currently, Global Certification Forum (GCF) is working towards introducing LTE certificati...
COM Express High-end Module based on Intel 45nm Core 2 Duo processor
The COM Express module family CXB-GM45 in the “basic” format 125 x 95mm offered by MSC Vertriebs GmbH shows considerable performance leaps by means of computing power, graphics and memory technology compared to the previous platforms. The compact platform is based on single-core and dual-core processors from Intel‘s embedded low power Penryn generation, all built in 45nm technology, and the Intel® GM45 graphics and memory controller hub (...