Search results for "photon chips"
Aeroflex cdma2000/1xEV-DO Measurement Suite for PXI 3000 Series now supports 1xEV-DO Rev B for production testing of mobile terminals
Aeroflex announced today that the PXI 3030 cdma2000/1xEV-DO Measurement Suite now supports Revision B (Rev B) of the standard, at no additional cost to current licensees. This latest upgrade extends the capabilities of the Aeroflex PXI 3000 Series test system to include fast and cost-effective production testing of mobile handsets, components, and chipsets to the new standard revision.
Electronics Application Development and Numerical Libraries White Paper Now Available
Electronics and electrical engineers, many of whom are already contending with slower performance of legacy applications originally developed for 32-bit processors that are now operating in 64-bit systems or supercomputer-level resources, can now obtain a white paper tailored for concerns of electronics engineers--“The Benefits of Using Rigorously Tested Routines from Numerical Libraries—Electronics Engineering Edition”
CELLMetric Launches RF Channel Fading Options for Modus 6 LTE Composer
Cambridge based 4G cellular & digital broadcast company CELLMetric announces the launch of its new Long Term Evolution (LTE) RF channel fading option for Modus 6 LTE Composer at Telecom 2009 Geneva. CELLMetric’s LTE Composer tester provides a highly sophisticated RF and protocol sequence generation environment in which LTE RF and baseband chipset companies and cellular handset developers can quickly test their solutions against a repeatable a...
TRaC, Agilent Technologies Announce Comprehensive Bluetooth-Qualification Test System
TRaC and Agilent Technologies Inc. today announced the availability of TRaC’s Bluetooth test system, which uses Agilent’s N4010A Wireless Connectivity Test Set. The Bluetooth test system, developed by TRaC engineers in conjunction with Agilent hardware engineering, delivers a fully automated RF qualification solution to the Bluetooth Specification Test Suite Structure and Test Purpose System Specification 1.2/2.0/2.0+EDR/2.1/2.1+EDR. Addition...
Acrosser launch AMB-QM77T1 Mini-ITX industrial mainboard
The AMB-QM77T1 is the newest Mini-ITX industrial mainboard from Acrosser Technology that supports both of the 3rd and 2nd generation Intel Core i7/i5/i3 mobile processor by Intel QM77 chipset and FCPGA 988 socket.
Cost-Effective 1U Network Security Rack Mount Server for Small Business and SOHO
ACROSSER Technology is proud to lunch its latest low cost entry level networking platform for security and VOIP applications. For small office and home network communication, AR-R8601 features 3 fast Ethernet ports, energy efficient design and cost-effective platform adopts VIA CN700, VT8237R+ chipsets and Eden ULV 1.6GHz CPU enclosed in a rack-mount chassis (440x190x44mm).
PH200 single-channel benchtop nanowatt low noise optical-to-electrical converter
The Highland Technology PH200 is the first product in the 'PH' series of extreme-performance photonic instruments. The PH200 Nanowatt Photoreceiver, designed in collaboration with Phil Hobbs, is a free-space optical/electrical converter that provides near shot noise performance in a rugged, compact package. The unique photon feedback architecture delivers a bandwidth greater than 1 MHz, with an unprecedented combination of linearity, bandwidth, a...
VIA Announces VIA Nano X2 Dual-Core Processor
VIA Technologies announced its latest VIA Nano X2 processor for mainstream PC markets. Based on a 40 nanometer fabrication process, the VIA Nano X2 delivers better computational performance and improved multi-tasking ability without consuming more power.
VIA Nano Processor Readies VIA EPIA Boards for Next Generation Embedded Applications and Windows 7 Technologies
VIA Technologies, Inc today announced the latest VIA EPIA-M800 Mini-ITX and VIA EPIA-N800 Nano-ITX boards. Featuring the 64-bit, high-performance VIA Nano processor, these new embedded boards bring advanced digital multimedia performance to the next wave of embedded devices on forthcoming Windows 7-based technologies.
VIA Mobile-ITX Brings Further Miniaturization and Greater Flexibility to Embedded Devices
VIA Technologies, Inc today announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices. Mobile-ITX defines a uniquely compact 6cm x 6cm computer-on-module specification designed to enable an easier and less resource intensive development cycle for a range of ultra-compact, portable embedded systems.