Search results for "NTT Corporation"
Low Cost Breakout Boards Accelerate PLD Design And Hardware Evaluation
Lattice Semiconductor announced the immediate availability of three new low-cost I/O Breakout Boards: the MachXO 2280 Breakout Board, the ispMACH® 4256ZE Breakout Board and the Power Manager II POWR1014A Breakout Board.
Lattice Reference Design Enables Image Signal Processors (ISP) To Interface With Aptina HiSPi CMOS Sensors
Lattice Semiconductor announced full support for Aptina’s High-Speed Serial Pixel Interface (HiSPi) using LatticeXP2TM FPGAs. The LatticeXP2 HiSPi bridge reference design allows any Image Signal Processor (ISP) with a traditional CMOS parallel bus to interface with an Aptina HiSPi CMOS sensor.
New Package Option for Lattice MachXO PLD Family said to Reduce Cost and Board Area
Lattice has announced the availability of a new 0.8-mm pitch 256-pin Chip-Array BGA (caBGA256) package for its popular MachXO PLD family that provides designers with a broader range of package options for implementing cost-sensitive, board space constrained designs. The Mach XO640, XO1200 and XO2280 devices are now available in the 14 x 14 mm, caBGA256 package with up to 211 user I/O. The new packages provide designers with 10% lower cost and 30%...
Lattice Ships 25 Millionth MachXO Programmable Logic Device
Lattice Semiconductor has announced that it has shipped over 25 million MachXO PLDs. Broadly adopted in a wide range of high volume, cost sensitive applications, customers worldwide are using the MachXO PLD family due to its unparalleled ease-of-use, flexibility, system integration and price.
Lattice Semiconductor and Broadband Technology from Business Development Partnership
Lattice Semiconductor has announced that Broadband Technology AB will represent Lattice and its full range of products in the Nordic market, including Denmark, Finland, Norway and Sweden.
Lattice Inaugurates Asia Operations Center in Singapore
Lattice Semiconductor announced the formal opening of Lattice SG Pte. Ltd., its new Asia Operations Center. The opening was marked by a formal ribbon cutting ceremony and attended by Lattice executives Bruno Guilmart, President and CEO; Michael G. Potter, Chief Financial Officer; Clay Miller, Chief Information Officer; Byron Milstead, General Counsel; Douglas Hunter, Vice President of Corporate Marketing; and Willy Bowman, Vice President of Worl...
Lattice Ships Over 200 Million ispMACH 4000 CPLD Devices
Lattice Semiconductor announced that it has shipped over 200 million ispMACH 4000 complex programmable logic devices (CPLD). The Lattice ispMACH 4000 CPLD family provides a variety of design solutions, from glue logic and general purpose I/O expansion to voltage level translation and LED drivers. Engineers around the globe have widely adopted the ispMACH 4000 CPLD as a standard due to its balance of price, power and packaging options.
Lattice Diamond Design Software Named Finalist In Elektra Awards Competition
Lattice Semiconductor Corporation today announced that an independent panel of judges has named the Lattice Diamond design software environment a finalist in Elektra 2010, the European Electronics Industry Awards competition.
New release of Lattice Diamond Design Software accelerates FPGA design optimization for lowpower and cost sensitive applications
Lattice Semiconductor Corporation today announced release 1.4 of its Lattice Diamond design software, the design environment for Lattice FPGA products. Users of Lattice Diamond 1.4 software will benefit from several usability enhancements that make FPGA design exploration easier and reduce time to market.
Lattice Announces New 32 QFN Package For MachXO2 Programmable Logic Devices
Lattice Semiconductor Corporation today announced the immediate availability of its low cost, low power MachXO2 family of programmable logic devices (PLD) in a new 32 QFN (Quad Flatpack No-leads) package. Since the MachXO2 family's production release in 2011, customers worldwide have taken advantage of its innovative combination of ease-of-use, flexibility, system integration and affordability.