Search results for "photon chips"
RFMD Arms Popular Mobile Devices with Leading WiFi Connectivity Solutions
RF Micro Devices announced that global smartphone and tablet manufacturers designing around the WiLink™ 6.0 and WiLink 7.0 platforms from Texas Instruments Incorporated (TI) (NYSE: TXN) can integrate RFMD’s RF3482 to gain reliable, flexible WiFi connectivity. Volume shipments of the RF3482 have begun, and RFMD estimates shipments will increase in support of key cellular and consumer device manufacturers.
Imec produces high-quality EUV sensors for ASML’s next-generation lithography tools
Imec announces that it has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML’s NXE:3100 EUV lithography tools in the field, improving the tools’ overlay and critical dimension (CD) tool performance. With this milestone achievement, imec confirms that its CMORE business line is ready to provide its partners with custom specialty chip solutions.
TenAsys Embedded Virtualization Software Supports New Intel® Core™ Embedded Processors
TenAsys Corporation (www.tenasys.com), a leading provider of real-time OS and virtualization software, announces that all of its embedded virtualization software products, including the INtime® real-time OS for Windows®, provide full support for new 2010 Intel® Core™ processors and companion chipsets for the embedded market.
Assembleon Highlights Electricity Cost Savings In Pick & Place At This Year’s Ipc Apex
Assembléon is stressing the value of energy efficient pick & place at this year's IPC APEX Expo (Las Vegas April 12-14, Booth 508). While saving up to $10.000 in operating costs alone per pick & place machine per year, the low energy consumption of all A-Series solutions in the market today help to drastically reduce the SMT industry’s carbon footprint. The company is also using APEX to announce the extension of its compact, modular and econom...
AssemblÉon Robot Reduces Cost Of Memory Module And Back-end Semiconductor Manufacturing
Royal Philips Electronics subsidiary Assembléon’s recently released Twin Placement Robot (TPR) is reducing the cost of placement for memory module assembly, and will soon be doing the same for semiconductor backend manufacturing. The TPR fits on Assembléon’s A-Series pick & place equipment to give a single platform that can place up to 110,000 ICs and chip components per hour – eliminating the need for a separate line balancing machine. T...
Assembleon Robot Reduces Cost Of Memory Module And Back-end Semiconductor Manufacturing
Royal Philips Electronics subsidiary Assembléon’s recently released Twin Placement Robot (TPR) is reducing the cost of placement for memory module assembly, and will soon be doing the same for semiconductor backend manufacturing. The TPR fits on Assembléon’s A-Series pick & place equipment to give a single platform that can place up to 110,000 ICs and chip components per hour – eliminating the need for a separate line balancing machine. T...
Two International Industry Awards For Assembleon's Twin Placement Robot
Assembléon’s Twin Placement Robot, the latest addition to its A-Series pick & place equipment, has been received multiple innovation awards at this year’s Nepcon China in Shanghai. The Twin Placement Robot (TPR) received EM Asia’s Innovation award 2011 in the high volume assembly category. In the same category it also received the award for best exhibited technology from the SMT Association China.
Rohde & Schwarz delivers the world's first RF test systems for acceptance testing of VAMOS-capable mobile devices
The R&S TS8950G and R&S TS8980S RF test systems from Rohde & Schwarz now allow conformance and precompliance testing for VAMOS. Using VAMOS, network operators can double the channel capacity of GSM base stations.
Zoran Deploys Cadence Virtuoso Software for Complex, Advanced Technology, Mixed-Signal Chip
Cadence Design Systems today announced that Zoran Corp., a leading provider of digital solutions in the digital entertainment and imaging markets, taped out a complex, advanced technology mixed-signal chip using the Cadence® Virtuoso® suite of design and simulation products. Zoran adopted the Virtuoso technology to address the growing complexities and challenges its engineers faced moving to advanced nodes.
AppliedMicro Standardizes on Cadence Encounter Digital Implementation System
Cadence Design Systems today announced that Applied Micro Circuits Corporation has selected the Cadence Encounter Digital Implementation (EDI) System for its large, complex advanced-node designs. EDI System joins other multiprocessing-capable offerings in the AppliedMicro methodology to form a standardized design infrastructure based set of tools.