Search results for "siemens"

CCE announced today that it has added several key capabilities in the latest update of EnSuite version 2.2 – its flagship software for sharing detailed product knowledge across the extended enterprise, with ease. “We are very excited at the latest EnSuite update that comes packed with productivity tools for people in Manufacturing Support and Supply Chain job functions”, says CCE’s V.P. of Sales & Marketing, Mr. Vinay Wagle. He adds, “T...

Longview Advisors, the organizer of the 2008 3D Collaboration & Interoperability Conference and Exhibition, today announced that the lineup for this years event is complete, featuring renowned speakers, elite sponsors, and a host of international experts in the field of Collaboration and Interoperability in global manufacturing. The unique event will be held May 15th & 16th, 2008 at the Denver Athletic Club in Denver, Colorado.

To accelerate deployment of Field Device Integration (FDI) technology, key automation suppliers have agreed to enlarge the scope of the EDDL Cooperation Team and will become the FDI Cooperation. The intent is to assure a uniform device integration solution for process industries across all host systems, devices and protocols as required by end users.

WEG UK’s growth continues apace, with the appointment of Philip Hall, a highly skilled, senior professional in business development, to its sales team. Phil has over 30- years experience in the electric motor and drives markets, working with major companies such as Siemens, Rockwell, Reliance, Teco-Westinghouse and Parker Hannifin. He was most recently employed as Business Development Manager for Brook Crompton.

Linear motor technology has come to large machining centres with the introduction of a new model called LinearMill from Mecof, Italy. Of moving cross rail, vertical spindle design, the machine has a huge working envelope of 2,500 to 10,000 mm in the X-axis by up to 2,200 mm in Y and 1,000 mm in Z.

A new vertical turning lathe (VTL) has been introduced by DS Technology, Birmingham, that can be configured with milling and grinding capability, robotic tool exchange, automatic pallet change and other features to bring the benefits of unattended, single-hit machining to the production of very large workpieces.

Molex introduced the Brad IO-Device protocol development kit version 2.2 for PROFINET that enables OEMs to develop and market their own branded PROFINET IO devices. Fully-compliant with PROFINET IO version 2.2 specifications, the Molex protocol stack supports conformance Class-B and has already been integrated on customer system platforms and successfully PNO-certified by the PROFIBUS User Organisation.

Isabellenhütte, Semikron and Siemens Drive Technologies have cooperated to develop a 3 phase shunt module for the Siemens SINAMICS G120 frequency inverter series. This series is intended for measuring phase currents of up to 20 A through shunts on the circuit board. Apart from this, currents of up to 400 A can be measured with outstanding precision and long-term stability using the jointly developed shunt modules in Semikron’s Semitrans housin...

Under the auspices of Intel Corporation and in cooperation with TQ-Group and apra-norm, congatec AG has launched the Embedded Building Blocks initiative to make it easier for small and medium-sized businesses (SMEs) to gain access to embedded computer technology and entry into the industrial computer market.

National Semiconductor Corp. (NYSE : NSM) a dévoilé aujourd'hui le premier chipset émetteur/récepteur ultrasons 8 canaux du marché, spécialement conçu pour les systèmes ultrasons portables utilisés dans les hôpitaux, les cliniques, les ambulances ou les équipements de soin à distance. L'architecture innovante du chipset PowerWise® permet de concevoir des unités portables ou portatives dotées d’une autonomie sur batterie supérieu...