Search results for "pcb"
Meder Electronic LI series of ultra-miniature reed relays
MEDER electronic Inc. announces the availability of the new and improved LI series of reed relays, an ultra-miniature relay ideal for use in high-voltage applications, including cable and in-circuit test equipment, high voltage test equipment, photovoltaic application change-over switches, as well as the emerging electric vehicles market.
5mm Ultra-Miniature Surface Mount Reed Sensor Boasts High Performance
MEDER electronic, Inc. today introduced the MK24 series Reed Sensors measuring only 5mm x 1.8mm x 2.2mm they meet a minimum life expectancy of 50 million operations at 5V, 5mA, 100Hz. This tiny energy saving device requires no external power to operate making them especially well suited for low power applications. Sensitivity ranges from 1.5-10mT are available.
Saelig Debuts GTO – GUI Software Speeds PCB Assembly Design Verification
Saelig Company, Inc. announces the availability of GTO, - an easy-to-use Graphical User Interface tool, expressly designed to help rework technicians, assembly technicians, and printed circuit board assembly contract manufacturers to easily locate single or multiple components on a PCB.
Manncorp Introduces Five-second Online Quote Service & New Product Pages
With realization of the importance that price plays in the selection of PCB assembly equipment, www.manncorp.com has been redesigned to furnish a quotation on any product within five seconds. This landmark feature, reportedly unique to Manncorp, is activated whenever the five-second digital timer – appearing on every product page – is clicked. As soon as the user provides the brief identification information required, the countdown be...
Two International Industry Awards For Assembleon's Twin Placement Robot
Assembléon’s Twin Placement Robot, the latest addition to its A-Series pick & place equipment, has been received multiple innovation awards at this year’s Nepcon China in Shanghai. The Twin Placement Robot (TPR) received EM Asia’s Innovation award 2011 in the high volume assembly category. In the same category it also received the award for best exhibited technology from the SMT Association China.
AppliedMicro Standardizes on Cadence Encounter Digital Implementation System
Cadence Design Systems today announced that Applied Micro Circuits Corporation has selected the Cadence Encounter Digital Implementation (EDI) System for its large, complex advanced-node designs. EDI System joins other multiprocessing-capable offerings in the AppliedMicro methodology to form a standardized design infrastructure based set of tools.
Cadence Releases Industry’s First Wide I/O Memory Controller IP Solution
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that it is first to market with a licensable, wide I/O memory controller core, along with an integration environment, that brings PC-like performance to mobile applications like smartphones and tablets.
Scientific Research Leader CERN Relies on Cadence Services to Provide an Advanced and Integrated Design Environment
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global design innovation, today announced that CERN, the European Organization for Nuclear Research, is relying on Cadence ® Services to create and maintain design environments for internal design teams as well as for design teams in a number of collaborating physics institutes throughout Europe and the United States.
ABI Electronics at Global Technology Awards 2009
ABI Electronics, a leading manufacturer of test and measurement equipment, and Cupio, a technology partner and supplier of test solutions, are hoping for a win at the upcoming Global Technology Awards in November. The competition, sponsored by the Global SMT & Packaging magazine, recognises the verybest innovations in the PCB and electronics world.
Evatronix Enhances its USB Portfolio with High Speed Inter-Chip (HSIC) Compatible PHY IP
Evatronix SA, the leading provider of USB-IF certified solutions for SuperSpeed USB 3.0 and USB 2.0 IP, have announced today the introduction of a High Speed Inter-Chip (HSIC) compatible PHY IP for significant power and area savings in USB 2.0 chip-to-chip connections.