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A deep dive into resolution from sensor standpoints
Resolution can be defined as the number of distinct elements that a sensor can capture, i.e., the sensor’s ability to distinguish between two closely spaced points. It is specified in pixels.
Gender gap in AI: men dominate new PhDs in AI
Artificial Intelligence (AI) isgrowing fast, taking over the digital space while influencing how people live, work, and even play.
Robotic security use cases and implementation for a secure future
In this article, Manoj Rajashekaraiah, Principal Engineer, Analog Devices will provide an overview of the components that constitute an industrial robot/cobot.
Output couplers for ultrafast lasers
Output couplers are used predominantly in laser resonators to extract the beam.
Seica Battery show Stuttgart
SEICA is pleased to announce that they will once again be present at the Battery show in Stuttgart at Booth B16 in Hall 8, displaying the latest innovative test solutions developed specifically for the EV sector.
University Kaiserslautern fast tracks quantum computer development
There are various methods for constructing a Quantum Computer (QC), and RPTU Kaiserslautern's approach within the Rymax One collaboration involves creating an array of single atoms that function as qubits.
Significant development for the life sciences sector
Construction has commenced on three new, state-of-the-art laboratory and office buildings at The Oxford Science Park (TOSP), a premier location for science and technology companies in Europe.
Alphawave, Samsung partnership extended to 2nm processes
Alphawave Semi has expanded its strategic partnership with Samsung Foundry. The expanded agreement encompasses leading-edge IP for PCI Express 7.0, 112G and 224G Ethernet and the latest UCIe (Universal Chiplet Interconnect Express) die-to-die interconnect standard that is enabling next-generation SoC (system-on-chip) technologies for AI and other HPC systems.
WeEn Semiconductors releases advanced SiC technologies with TSPAK packaging
New families of silicon carbide (SiC) MOSFETs and Schottky Barrier Diodes (SBDs) in TSPAK packaging are being premiered by WeEn Semiconductors at PCIM Europe in Nuremberg (June 11-13).
Power Integrations revs up motor-drive offering
Power Integrations has enhanced its hardware-software bundle for brushless DC motors (BLDC) with the introduction of BridgeSwitch-2.