Search results for "photon chips"
Bulk Metal Z-Foil Wraparound Surface-Mount Resistor from Vishay
Vishay has introduced the improved VSMP0603 ultra-high-precision Bulk Metal® Z-Foil (BMZF) wraparound surface-mount resistor with an extended power rating to 0.1 W and higher resistance values to 5 kΩ. The device is the industry's first in the 0603 chips size to offer a military-grade absolute TCR of ±0.2 ppm/°C from −55°C to +125°C, +25°C ref., a tolerance of ±0.01%, and an almost immeasurable 1-ns rise time, effectively withou...
Ikanos Unveils NodeScale Vectoring to Deliver Broadband at 100 Mbps and Beyond for One-Tenth the Cost of Fiber
Ikanos Communications today introduced NodeScale Vectoring. This breakthrough DSL access technology enables 100 megabit per second (Mbps) performance and beyond, speeds that were previously unattainable in the vast majority of the world's service provider networks. By deploying Ikanos' state-of the-art NodeScale Vectoring technology, service providers will be able to extend very high-speed Internet access and new critical services - including mul...
Molex QSFP+ Active Optical Cable (AOC) Assemblies Provide Unmatched Reach at a Fraction of the Power
Molex Incorporated introduces its Quad Small Form-factor Pluggable (QSFP+) Active Optical Cable (AOC) assemblies, providing the longest link distance and lowest power consumption on the market today.
Thermally Conductive Adhesives Keep Their Cool by Master Bond
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today's electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices. Master Bond's white paper examines the challenges design engineers face...
XMOS releases new package and pricing on XS1-G4
XMOS has released a new package option for the G4 programmable device, the first member of the XS1-G4 family. The new 144-pin BGA package option is designed for systems that require the smaller form factor (11mm square). With a .8mm ball pitch it is ideal for compact designs and simple PCB layout. For designs that require a full complement of 256 I/O pins a 512-pin BGA package is available.
Software Defined Silicon development kit from XMOS accelerates electronic design
XMOS Semiconductor has introduced a development kit providing everything needed to develop a wide range of applications using its XS1-G4 programmable device. Designs are created using a C-based software development flow that dramatically shortens the time required to build electronic products and systems.
CETECOM Selects Spirent Communications for Location Technology Conformance Testing
CETECOM has selected Spirent’s 8100 Location Technology Solution to provide the industry’s first and only SUPL 2.0 conformance test capability for GSM and WCDMA devices, based on standards from the Open Mobile Alliance (OMA).
Digi-Key and Advanced Thermal Solutions Sign Worldwide Distribution Agreement
Advanced Thermal Solutions, Inc. (ATS) has partnered with Digi-Key, the global electronic components distributor, to offer over 380 heat sinks for cooling BGAs and other hot-running semiconductor devices. The heat sinks are available for immediate delivery when purchased through Digi-Key’s Web site and printed catalogs. Design engineers can obtain individual ATS sinks for prototypes and testing, or larger volumes for production requirements. D...
NEC Electronics Announces USB 2.0 Host and Peripheral Controller
NEC Electronics has announced an integrated USB2.0 host and peripheral controller designed to enable high-speed digital data sharing among electronic equipment such as digital camera and printer. On a single chip, the PD720150 integrates communications functions that formerly required separate USB host and controller chips. In addition to reducing the device count and saving board space, it facilitates software development by implementing numer...
NEC Electronics and ELMOS to enter Strategic Partnership
NEC Electronics and ELMOS Semiconductor AG are going to join forces demonstrated by entering into a worldwide long-term partnership. The agreement will encompass the joint development, cross-use of engineering and manufacturing services as well as common marketing of products for the automotive and industrial markets.