Search results for "pcb"

GOEPEL electronic GmbH recently introduced a wide range of innovations in all of its AOI systems. All offline and inline OptiCon series AOI systems feature the new software version OptiCon PILOT 5.2, characterised by numerous new functions. The improved ease of use during program generation and optimization is one of the key features.

Molex has introduced EdgeLine, a family of one-piece, low-cost connectors supporting high-speed signal transmissions using a card edge interface and a vertical or right angle insertion. Molex’s EdgeLine 12.5 Gbps Edge Card and CoPlanar connectors are a flexible and scalable solution for a wide variety of low- to mid-range telecom, computing, and storage applications.

Molex has introduced the Stac64 connection system, which provides single and multi-pocket PCB solutions to offer a diverse range of circuit sizes and greatly reduce time-to-market by completely eliminating custom tooling.

Molex introduced the Quad Small Form-Factor Pluggable Plus (QSFP+) interconnect solution designed for a multitude of markets and applications including switches, routers, Host Bus Adapters (HBAs), enterprise data centres, high-performance computing (HPC) and storage. Components of the system include the Electromagnetic Interference (EMI) shielding cage, passive cable assembly, active cable assembly, optical MTP cable assembly, optical loopback an...

Molex Incorporated has introduced its OEM-proven MX123, a fully sealed, high-performance interconnect system optimised for transportation power-train applications. The MX123 system maintains low and stable contact resistance under severe temperatures and vibrations making it ideal for on-engine automotive applications, off-road construction and industrial equipment.

XP Energy Systems Ltd, an XP Group company, announces the CCR Series modular rack-mount power system which is designed to provide 240 to 1440W. Unusually for a power system of this size, CCR Series units are convection cooled and do not require fans or forced air for operation.

Vishay today announced that its Vishay Foil Resistors division has released a new family of ultra-high-precision Bulk Metal Z-Foil hybrid chip resistors. Offering an order of magnitude improvement over other chip resistors for hybrid applications, the new V5X5Z, V15X5Z, and V15X10Z are the industry's first to offer low typical TCR of 0.05ppm/°C from 0°C to +60°C and 0.2ppm/°C from -55°C to +125°C, +25°C ref., TCR tracking to 0.5ppm/°C, f...

Vishay has announced the release of three new ultra-high-precision Bulk Metal Z-Foil surface-mount resistor networks that offer the best combination of stability features ever achieved in the ball grid array (BGA) format. The devices provide absolute TCR of ± 0.05 ppm/°C from 0 °C to + 60 °C and ± 0.2 ppm/°C from − 55 °C to + 125 °C, + 25 °C Ref., PCR tracking (“ΔR due to self heating”) of ± 5 ppm at rated power, and a lo...

Vishay Intertechnology has announced that it has extended its 298D series of MicroTan solid tantalum chip capacitors to offer an industry-best capacitance-voltage rating in the molded 0402 package size. Leveraging the patented MAP (multi-array packaging) assembly technology, Vishay's 298D MicroTan capacitors have been extended to offer high capacitance-voltage ranges from 4.7μF-4V to 10μF-4V in the ultra-compact 1.0-mm x 0.5-mm 0402 K-...

Vishay Intertechnology has announced the release of the new TR8 series of molded MicroTan tantalum chip capacitors that provide ultra-low ESR values of 0.8Ω (at 100kHz and 47μF) in the 0805 case size, and an industry-low 1.5Ω in the 0603 case size.