Search results for "Toshiba"

Toshiba Electronics Europe has announced that Toshiba Corporation has started volume production of silicon carbide (SiC) power devices, in anticipation of growing demand for industrial and automotive applications. Production is at Toshiba’s Himeji Operations–Semiconductor, Hyogo Prefecture, Japan.

Toshiba has further expanded its family of CMOS area image sensors by offering a 1.12μm, 8 Megapixel device in an unpackaged, die format. The T4K05 integrates a number of features that support the miniaturization of camera modules, allowing designers to reduce the size and height of mobile devices.

Safety, security and ultra-low power were the overriding themes of this year’s Embedded World Exhibition and Conference, which took place to great success between February 25th to 27th in Nürnberg, Germany. Philip Ling reports for ES Design magazine.

Later this month, IC Insights’ May Update to The 2013 McClean Report will show a ranking of the top 25 semiconductor suppliers in 1Q13. A preview of the top 20 companies is listed in Figure 1. The top 20 worldwide semiconductor (IC and O S D—optoelectronic, discrete, and sensor) sales leaders for 1Q13 include nine suppliers headquartered in the U.S., four in Japan, three in Europe, and two each in South Korea and Taiwan, a relatively broad re...

Toshiba have today announced that it will start to develop a new product line of embedded microcontrollers including an advanced motor control co-processor, the Vector Engine. In recent years, demand has grown for energy and energy efficient products. Toshiba is working on solutions to promote smart community in various areas, and semiconductors form an important part of this effort.

Yole Développement announces its SiC Market 2013: Technology and Market for SiC Wafers, Devices and Power Modules report. Yole Développement’s report focused on the entire value-chain, covers all SiC applications in low, medium and high power ranges and provides all metrics up to 2020. It also includes a Bill-of-Material analysis, to compare Silicon vs. SiC-based system costs, and a cost reduction roadmap for SiC devices.

Toshiba Electronics Europe is pleased to announce today that it will offer a Full-HD, 1.12μm, back-side illumination CMOS image sensor featuring an integrated colour noise reduction circuit for applications including mobile phones and smart phones, PCs and tablet PCs.

Toshiba Corporation have revealed today that it will launch a vector engine embedded microcontroller with a low-pin count and wide pin pitch, which makes lower mounting costs possible, as the latest addition to the ARM Cortex-M3 core-based TX03 series line-up. Mass production of the new product TMPM372 will start in May 2013.

This paper looks at the trend in control electronics for high power stepper motors, used particularly in CNC machines, and describes a modern solution that delivers power, processing and cost efficiency, which should test if the high proportion of German Subcriptors is true. Germany is a strong industrial basis so we should have a high hit rate.

Toshiba unveil the industry’s thinnest CMOS image sensor camera module with high-resolution, 13 mega pixel imaging ideal for next-generation, ultra-thin smartphones and tablet devices. The new TCM9930MD leverages an advanced image pre-processing LSI (companion) chip and a refined module structure to create a compact image sensor camera module with the industry’s lowest profile at just 4.7 mm.