Search results for "pcb"
Goepel's theme at SMT/Hybrid/Packaging 2010 is “Best in Test”
At this year’s SMT/Hybrid/Packaging in Nuremberg/Germany, GOEPEL electronic will exhibit its award winning test solutions in Automated Inspection (AOI/AXI) and JTAG/Boundary Scan technology. In hall 6, stand 410 the Company will demonstrate its technological leadership in the fields of optical and electronic test and measurement.
EMS Company Limtronik opts for GOEPEL electronic’s AXI System
The German contract manufacturer Limtronik has decided on GOEPEL electronic’s Automated X-Ray Inspection system OptiCon X-Line 3D for enhanced quality assurance of its products. In addition to the system’s test speed, the critical factors in favour of this decision were the in-line ability and 3D functionality of the AXI machine. Moreover, as far as future innovations and service are concerned, Limtronik decided for an AXI direct from an O...
GOEPEL electronic explores new Dimensions
Multidimensional test and inspection technologies are the focal aspect of GOEPEL electronics’ show appearance at this year’s SMT/Hybrid/Packaging in Nuremberg/Germany. The trade show will be used to introduce additional world premiere solutions.
GOEPEL electronic to exhibit Industry leading Test Equipment at IPC APEX 2012
GOEPEL electronic will be present again at this year's IPC APEX in San Diego, CA, exhibiting the latest JTAG/Boundary scan solutions and industry leading AOI, AXI, and THT inspection solutions at booth # 2450.
Automated Inspection of Bonding Pads
GOEPEL electronics’ OptiCon AOI systems can now be utilised for automated inspection of bonding pads for solder splashes, deformations and any other impurities in the micrometer range.
Enhanced OptiCon AOI System Series – Innovations in all
GOEPEL electronic GmbH recently introduced a wide range of innovations in all of its AOI systems. All offline and inline OptiCon series AOI systems feature the new software version OptiCon PILOT 5.2, characterised by numerous new functions. The improved ease of use during program generation and optimization is one of the key features.
Molex Unveils EdgeLine 12.5 Gbps Edge Card and CoPlanar Connectors
Molex has introduced EdgeLine, a family of one-piece, low-cost connectors supporting high-speed signal transmissions using a card edge interface and a vertical or right angle insertion. Molex’s EdgeLine 12.5 Gbps Edge Card and CoPlanar connectors are a flexible and scalable solution for a wide variety of low- to mid-range telecom, computing, and storage applications.
Molex Stac64 Connection System Meets Electronic Device Requirements in Today’s Vehicles
Molex has introduced the Stac64 connection system, which provides single and multi-pocket PCB solutions to offer a diverse range of circuit sizes and greatly reduce time-to-market by completely eliminating custom tooling.
Molex - Quad Small Form-factor Pluggable Plus (QSFP+) solution
Molex introduced the Quad Small Form-Factor Pluggable Plus (QSFP+) interconnect solution designed for a multitude of markets and applications including switches, routers, Host Bus Adapters (HBAs), enterprise data centres, high-performance computing (HPC) and storage. Components of the system include the Electromagnetic Interference (EMI) shielding cage, passive cable assembly, active cable assembly, optical MTP cable assembly, optical loopback an...
Fully-sealed interconnect system from Molex
Molex Incorporated has introduced its OEM-proven MX123, a fully sealed, high-performance interconnect system optimised for transportation power-train applications. The MX123 system maintains low and stable contact resistance under severe temperatures and vibrations making it ideal for on-engine automotive applications, off-road construction and industrial equipment.