Search results for "pcb"

Alpha’s Regional Applications Manager Europe, Alan Plant is to present at the European Electronics Assembly Reliability Summit, September 21-23, 2010 in Tallinn, Estonia. Low silver alloys are now commonplace in the production of solder spheres for BGA and CSP components but their adoption in solder paste formulation and use has been slower and more conservative.

MIRTEC announces that it has been awarded the 2012 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – AOI for its revolutionary MV-9 3D AOI Series. The award was presented to the company during an April 26, 2012 ceremony in Shanghai during NEPCON China 2012. Established in 2006, the EM Asia Innovation Awards program recognizes top performing companies for achieving the highest standards in the various manufact...

MIRTEC announces that it will showcase its award-winning MV-9 3D Series AOI System alongside a range of other groundbreaking AOI and SPI technologies at its distributor pb tec’s Booth 7:506B during SMT Nuremberg, scheduled to take place May 8-10, 2012 at the Messezentrum in Nuremberg, Germany.

Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman will present at the upcoming technical workshops titled “Cleaning Electronic Assemblies,” that will be held at two separate locations in Texas. The first workshop is scheduled to take place Tuesday, August 2, 2011 from 9 a.m.-4 p.m. at the Doubletree Hotel in ...

Kyzen will showcase products for every process at the upcoming VIRTUAL PCB virtual tradeshow and conference, scheduled to take place March 8-9, 2011.

Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman will teach a Professional Development Course on the IPC-CH-65B Guidelines for Cleaning of Printed Boards and Assemblies at the upcoming IPC Midwest Conference & Exhibition, scheduled to take place September 21-22, 2011 at the Renaissance Schaumburg Hotel and Conve...

Binder UK has today announced that it will be showing a wide range of circular connectors on Stand D11 at Sensing Technology 2012 to be held at the NEC, Birmingham on 25th and 26th September. Products will include the extensive range of M5, M8 and M12 sensor connectors used widely in the sensor, instrumentation, automation, medical and industrial equipment markets, along with new product developments such as high current versions of M12 connector...

Swissbit announces new variations of its INDUSTRIAL family of DDR3 SODIMMs. In order to increase the heat dissipation and to avoid thermal hot spots on the memory modules in systems with difficult cooling, Swissbit can add an aluminum heat spreader to the existing portfolio of DDR3 SODIMMs. The dual sided heat spreader is attached with a thermally conductive tape and increases the heat dissipating area, thus reducing the critical high case temper...

Ultra Electronics, Manufacturing & Card Systems, a leading contract electronics manufacturer operating in the aerospace, security, transport and energy markets, announces that Extec Integrated Systems has now been acquired and integrated into Ultra’s CEMS business. Ultra and Extec share many similar target customers in markets that demand high-reliability products, as well as sharing a focus on compliance to the highest standards of manufacturi...

Geotest will showcase the TS-900, an integrated PXI-based test system that is targeted for semiconductor OEMs, fabless semiconductor vendors and packaging / test vendors needing a low cost, configurable test system. The basic system includes a high performance, 20 slot, 3U chassis, an integrated, high-performance receiver interface and Geotest's market-leading GX5295 100 MHz digital instrument which features a PMU per pin architecture and per pin...