Search results for "soldering"
KYZEN has two papers at APEX conference
KYZEN’s Dr Mike Bixenman (pictured) will present two papers at the upcoming San Diego IPC APEX EXPO. “Electrochemical Methods to Measure the Corrosion Potential of Flux Residues” will be presented during Session S04 on Feb 14. The paper was co-authored by David Lober and Anna Ailworth, KYZEN, and Bruno Tolla, Ph.D., Jennifer Allen, Denis Jean and Kyle Loomis from Kester Corporation.
Compact connector supports CAT5 cabling for industrial modules
A rugged I/O connector has been developed by Hirose which boasts a space-saving design that enables a size reduction of industrial modules. The IX Series connector provides a space savings of up to 65% compared to RJ45 solutions, and up to 28% compared to competing snap-in I/O connector offerings.
We have lift off: battery packs successfully installed at NASA’s ISS
NEO Tech has announced that six Lithium-Ion Battery Orbital Replacement Units (ORUs) that it assembled for Aerojet Rocketdyne were launched into space for the International Space Station on 9thDecember 2016, with the first three successfully installed in the International Space Station 6thJanuary 2017.
USB connectors feature low rear profile
The USB FeedThrough connector range manufactured by Cliff Electronics is in stock at distributor JPR Electronics. USB 3.0A to USB 3A, USB3.0 B to USB 3.0A, USB 2.0B to USB 2.0A and USB 2.0A to USB 2.0A versions are available from stock and provide true FeedThrough data connection for developing custom I/O configurations for rack panels, wall plates and control boxes.
Low pass ITF SMD filters exhibit sharp attenuation
Manufacturer of passive components and interconnect solutions, AVX Corporation has released a series of 15W high performance, low pass Integrated Thin Film (ITF) SMD filters that exhibit low insertion loss and sharp attenuation in high frequency wireless applications spanning 512MHz to 1,800MHz.
Toshiba adds SOIC packages to CMOS logic ICs
Toshiba Electronics Europe announced the availability of a line of CMOS logic ICs in small outline integrated circuit (SOIC) packages: the 74HCxxxD series. These products support flow and reflow soldering, and are suitable for industrial equipment and digital home appliances with logic levels of 6V and lower. The 63 new part numbers in the 74HCxxxD series consist of the most commonly used 74-series logic functions, bringing the total number of CM...
Entries now open for 'Off The Clock' design contest
Wurth Electronics Midcom's 'Off The Clock Design Challenge' is now open to the public. This is the premiere design challenge built for those who like to tinker. Participants will be designing a wireless charging end product using the new 15W wireless charging kit developed with ROHM Semiconductor.
Vertical poke-home connector released
AVX has released the first vertical connector capable of successfully bridging the gap between inexpensive, (but wildly inconsistent hand soldering processes) and expensive, but exceedingly reliable two-piece connector systems in high volume, 18AWG applications with perpendicular terminations and limited board space, including: power supplies, LED drivers, and industrial and motor controls.
What’s the difference between prototyping and rapid prototyping?
If I ask for a definition of the difference between prototyping and rapid prototyping, would the correct response be "it's faster - duh"?I would probably hear that a few times, but that really isn't the correct assessment. Yes, it is faster - duh - but it's faster because it's done differently.
'Turn toward the future' at IPC APEX EXPO
Visitors to San Diego, California from 14thto 16thFebruary 2017 are invited to 'turn toward the future' at theIPC APEX EXPO. Rehm Thermal Systems will be at this major electronics trade show and will present its latest plant technology for reliable reflow convection and condensation soldering at booth 1901.