Search results for "Master Bond"
Outsourced SAM testing provides a solution
Ultrasonic-based Scanning Acoustic Microscopy (SAM) has long been the method of choice for quality testing and failure analysis of silicon ingots, wafers, integrated circuits, and MEMS. Ultrasound can locate voids and disbonds between material layers better than other non-destructive methods because sound waves can look inside the layers to detect the thinnest of air gaps and delaminations down to a hundredth of a micron.
Automotive-compliant LED driver for rear lighting designs
Diodes Incorporated has expanded its portfolio of devices supporting automotive exterior illumination with the introduction of theAL5873Qthree-channel linear LED driver targeted at simplifying rear lamp cluster designs.
The changing technology of DC/DC converter design and manufacture
Changes in DC/DC converter technology have introduced new materials, digital control and smaller form factors, explains Lars Foerster, DC/DC business development manager, EMEA, TDK-Lambda
1,500V power module doubles as solar and storage use
It is often the case that when components are targeted at large currents and voltages the amount of applications that they can be used in shrinks.
CNC machining aerospace parts: what you need to know
The global aerospace industry has been delivering innovative and groundbreaking manufacturing technologies for decades. The demand for machined components has increased exponentially over the years owing to the expansion of technological horizons. ByPeter Jacobs, Senior Director of Marketing at CNC Masters
Accurate test solution for UWB device localisation
Rohde & Schwarz and Colby Instruments have joined forces to provide the UWB ecosystem with an extremely accurate test solution for angle of arrival (AoA) and phase difference of arrival (PDoA) characterisation.
Conveniently packaged polyurethane potting compound
From July 2021, the newIRS 3078 Polyurethane Potting Compoundis available from adhesives and dispensing equipment specialist Intertronics. The material is packaged in side-by-side cartridges, making it suitable for customers with small volume needs. IRS 3078 complements the company’s extensive range of materials and equipment for electronics bonding, potting, coating and encapsulating.
Duo deliver automated UWB test solution
A collaboration between Rohde & Schwarz and Colby Instruments, has provided the Ultra-Wideband (UWB) ecosystem with an extremely accurate test solution for angle of arrival (AoA) and phase difference of arrival (PDoA) characterisation.
Relec and Digiwise team up to aid display design
The popularity and versatility of HDMI means that embedded SBCs face more display design demands. To stay ahead of this industry trend Relec Electronics and its partner Digiwise have been developing new sizes and products to meet customers’ innovative design requirements.
Synchronous measurement for 5G mobile network
Anritsu has announced an upgraded synchronous measurement function for the company’s Network Master Pro MT1000A, the small tester supporting mobile networks up to 100Gbps. Fifth generation (5G) networks are expected to support increasing future numbers of applications and services, such as hi-definition video streaming, autonomous driving, IoT sensing, smart factories.