Search results for "pcb"
ESSEMTEC to Highlight Flexible Swiss Made Solutions at IPC/APEX 2011
Essemtec announces that it will feature a range of new equipment in Booth #773 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Using Automatic and Semiautomatic Pick-and-Place Systems in Parallel Proves a Successful Strategy
Combining an automatic SMD pick-and-place for series production with a semiautomatic placer for prototyping proves beneficial. A universal data interface developed by Essemtec ensures an easy, secure transition from prototyping into production and avoids confusion about data versions.By Adrian Schärli, Azular GmbH, for Essemtec AG
Essemtec’s ePlace 4.0: A Quantum Leap
Fourth generation ePlace software makes operating an SMD pick-and-place machine easier while saving both time and money. Due to Windows 7 and an SQL database, the system is simpler to integrate as well. ePlace 4.0 is the most modern graphical user-machine interface from Essemtec. Currently, various SMD placement machines are compatible with ePlace, including Paraquda and Cobra.
Essemtec Premiered New Pick-and-Place “Paraquda” at Productronica
“Paraquda” from Essemtec is the world’s most modern SMD pick-and-place machine. New materials used lead to higher quality and a new high-speed control system provides both higher speed and higher precision. The Paraquda features ultra short changeover times, a new intuitive operation system Eplace and an integrated quality management system that reduces manufacturing costs for electronics. Essemtec will premier the new machine at the upcomi...
Littelfuse Introduces 977 Series 5x20mm-Size 500VAC/450VDC Fuses
Littelfuse introduced its new 977 Series of ceramic body, 5x20mm-size fuses designed for circuit protection in both high-power AC and power-efficient DC applications. The 450VDC rating of the 977 Series sets it apart from other manufacturers’ fuse products.
ADATA Unveils XPG Gaming Series V2.0 DDR3 2133G and DDR3 1866G Dual Channel Kits
ADATA Technology, one of the world’s leading manufacturers of high performance DRAM modules and NAND Flash application products, today announced an expansion of its XPG Gaming Series V2.0 product line with high capacity DDR3 memory modules, the DDR3 1866MHz and 2133 MHz.
Touch Screen Modules Are Smarter Than Most
Noritake Itron’s TU480X272C-K612A1T intelligent iSMART 4.3in TFT analogue touch screen module features a fast access, 100 page display memory with re-usable display pages and menus. A raft of applications range from elevators to processing and temperature and climate control.
New versions of Binder M12 are pre-terminated to Profibus cable
Binder UK, the newly formed subsidiary of Franz Binder, the German connector manufacturer, now supplies an enhanced version of the Series 766 range of M12 B-coded connectors that is available with bulkhead sockets pre-terminated on 0.5m Profibus cable.
Blakell Europlacer Announces The ii Software Suite
Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces the ii suite which includes solutions for managing efficiently your SMT production.
New Reflow Oven Introduced by APS Novastar
APS Novastar (http://www.apsgold.com) announces the introduction of the ERO-500 Reflow Soldering System. The addition of the ERO-500 reflow oven fills out the mid-range of APS Novastar's reflow product line, providing its customer base with a cost-effective conveyor reflow oven with five (5) vertical heating zones and one (1) cooling zone. The ERO-500 has been developed for small to medium volume reflow soldering of SMT boards, hybrid boards, a...