Search results for "NTT Corporation"
Panduit exceeds 100 Gigabit Ethernet Transmission Standard
Panduit, a world-class developer and provider of Unified Physical Infrastructure (UPI) based solutions, has exceeded industry standards by successfully enabling a 100 Gigabit Ethernet transmission over 275 metres of Opti-Core™ laser optimised multimode fibre optic cabling at Ixia Corporation’s iSimCity lab in the USA.
Rogers Corp. to Showcase New RO4230™ High Frequency Circuit Material at Antenna Systems Show ‘06
Rogers Corporation will be introducing its RO4230™ high frequency circuit material at this year’s Antenna Systems Show.
Rogers Corp Celebrates 175th Anniversary by Ringing The Closing Bell at The NYSE
Rogers Corporation's president and CEO Robert Wachob rang The Closing Bell at The New York Stock Exchange Friday, May 11 in celebration of the company’s 175th anniversary. Rogers is a global technology leader providing solutions for a number of markets, including portable communication infrastructure, consumer products, computer and office equipment, ground transportation, and aerospace and defense. “We are honored to commemorate Rogers’ 1...
Rogers’ DUREL Division Introduces EL System Finishing Center Model
Rogers Corporation’s Durel Division has introduced an innovative Finishing Center model for use by graphics printers. The new Finishing Center model, employing Rogers’ thermal transfer and screen printing technologies, allows printers to produce thin, flexible, bright and animated backlit signs for a wide range of advertising needs.
Rogers Corporation Soars With Advanced Materials at SATELLITE 2010
Rogers Corporation will present a sampling of its microwave materials solutions at the upcoming SATELLITE 2010 (March 16-18, 2010, at the Gaylord National Convention Center, MD) located minutes from Washington D.C.
Rogers Corporation Earns DesignCon 2010 Paper Award
Rogers Corporation and its Advanced Circuit Materials (ACM) Division earned a distinguished DesignCon Paper Award at last month’s DesignCon 2010 Conference and Exhibition in Santa Clara, CA.
Rogers Offers High-Performance Circuit Materials & Design Guidance at 2011 IEEE International Microwave Symposium
Representatives from Rogers Corporation’s (NYSE:ROG) Advanced Circuit Materials Division (ACMD) will be on hand at the upcoming 2011 IEEE International Microwave Symposium (IMS) (www.ims2011.org) to share insights on the optimum use of the company’s high-performance circuit materials, including its RT/duroid® 6035HTC, and RO4360™ laminates. The 2011 IEEE IMS, scheduled for June 7-9, 2011 at the Baltimore Convention Center (Baltimore, MD), ...
Rogers Teams New RO4460™ Prepreg With RO4360™ Laminate For Matched 6.15-Dk Multilayer System Solution
Rogers Corporation (NYSE:ROG) has developed the perfect match for their popular RO4360™ laminate: RO4460™ prepreg. Both materials feature dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer high frequency circuits where space is at a premium.
Rogers Corporation Announces Agreement to Acquire Curamik Electronics GmbH
On December 31, 2010, Rogers Corporation signed a definitive agreement to acquire 100% of the stock of Curamik Electronics GmbH, a manufacturer of power electronic substrate products headquartered in Eschenbach, Germany, for €116 million (subject to closing adjustments). The acquisition will be financed through a combination of borrowings under existing bank credit facilities and cash and is expected to close this week.
Rogers Introduces New SYRON® Halogen-Free, High-Temperature Thermoplastic Circuit Materials for Harsh Environments
Rogers Corporation announced its new SYRON® 7000 and 7100 high-performance circuit materials, engineered for applications that demand outstanding high-temperature stability.