Search results for "photon chips"
Tensilica's Xtensa Processors Enable Next-Generation Mobile HD Radio Technology
Tensilica has announced that its Xtensa configurable processor has been designed into the baseband processor in Samsung EM's HD Radio chipset. The baseband processor, based on a design by iBiquity Digital Corporation, the developer and licensor of HD Radio technology and a Tensilica processor reseller, integrates the memory, SDRAM and flash in a system-in-package measuring just 9 x 9 mm.
Tensilica Supports MPEG-4 AAC-LC and aacPlus Multi-Channel Decoders for 7.1 Surround Sound
Tensilica has become the first processor IP company to announce the approval and availability of MPEG-4 AAC-LC, aacPlus v1, and v2 multichannel decoder implementations from Dolby Laboratories, Inc. These three multichannel decoders provide up to 7.1-channel surround sound for home entertainment devices. They are available now for the Tensilica HiFi 2 Audio Engine, the most popular audio architecture for system-on-chip (SOC) design.
Tensilica Showcases 4G LTE Baseband DSP IP Cores at MWC 2011
Tensilica should stand out at this year's Mobile World Congress (MWC) in Barcelona, February 14-18, 2011, as it has moved into the number one position as the supplier of baseband DSP (digital signal processors) IP (intellectual property) cores for the new generation of 4G LTE (Long Term Evolution) equipment. Eight of the top 15 LTE chipset manufacturers are working with Tensilica's cores for their designs.
STMicroelectronics and Semikron team up on power modules
Semikron International, known for its diode/thyristor power modules and an expert in power module packaging, and STMicroelectronics (NYSE: STM), have teamed up to develop and deliver integrated power modules for industrial, consumer, and automotive markets, embedding ST’s industry-leading power devices in Semikron’s SEMITOP® power packages.
Very Compact Thyristor Modules
SEMIKRON has introduced its SEMiSTART family of anti-parallel uninsulated thyristor modules, which has been designed specifically for use in soft-start devices. The modules are extremely compact. For example, a 400kW soft-starter featuring SEMiSTART is only one-sixth of the volume of the same device using conventional capsule thyristors. In addition, by using pressure contact technology and double-sided chip cooling, these new modules can withsta...
Ramtron and austriamicrosystems Collaborate to Deliver Third Generation Auto-Identification RF Solutions for Data-Rich Applications
U.S. semiconductor maker Ramtron International Corporation (Nasdaq: RMTR), a leading developer and supplier of ferroelectric-based low-power semiconductor products and austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high performance analog ICs, today announced the availability of the MaxArias Wireless Memory kit for evaluating third-generation, data-rich automatic identification applications. Ramtron’s MaxArias Wir...
Audio Icon Mark Levinson Teams with Intersil D2Audio to Develop Superior Audio Amplifiers
Intersil today announced it has signed an agreement with world-renowned audio expert, Mr. Mark Levinson. Under the agreement, Mark Levinson will partner with Intersil to jointly develop custom-tuned audio amplifier solutions that provide audiophile-quality music and sound for the next-generation of consumer products from portable music players to upscale music and home theater systems.
Small S-Video drivers increase battery life and remove glitches in portable video applications
Housed in tiny, ultra-slim μTQFN or chipscale packages, 9MHz low-pass reconstruction filters from Intersil remove quantization noise and switching glitches created by video DACs on an analogue output signal. The devices have integrated gain-of-two buffers and a summer that recombines the S-video signal to provide a composite video output for those applications where the DAC does not provide a composite video out. Coupled with their ultra-s...
Avago Technologies Introduces its Second Series of Hermetically Sealed 3.3V Optocouplers for Aerospace and Military Apps
Avago Technologies today announced its second series of hermetically sealed 3.3-volt high gain optocouplers for use in aerospace, industrial and military applications. Avago’s ACPL-570xL/573xL/177xL series include single, dual, and quad channel hermetically sealed optocouplers that are capable of operation at temperatures ranging from -55 to +125 degrees C to meet the harsh requirements of aerospace, industrial and military applications. Th...
Avago's CoolPAM power amplifiers used by a Leading Handset Chipset Supplier for HSDPA/W-CDMA Reference Design
Avago Technologies has announced that its CoolPAM power amplifier modules have been incorporated in a reference design from a leading W-CDMA chipset supplier. Handsets based on the design will ship beginning this fall, giving manufacturers a time-to-market advantage in delivering the major functionality for multi-mode third-generation (3G) mobile phones, data cards, PDAs and other mobile devices.