Search results for "OEM"
Agilent Technologies Introduces Turbomolecular Vacuum Pump Portfolio
Agilent Technolo announced a new line of turbomolecular high vacuum pumps, well-suited for ultra-high vacuum (UHV) applications requiring the highest level of compression ratios for light gases.
RFID Card Reader Writer offers multiple tag capability
DAILY RFID has launched 13.56MHz RFID card reader writer designed as a desktop, OEM version with USB and RS232 Interface. It is engineered to offers multiple tag capability, including ISO 14443 and 15693 protocol RFID tags, such as I-CODE, Mifare-One S50.
Low-cost Proximity RFID Reader with User-friendly Interface
DAILY RFID has launched its advanced Proximity RFID Reader-02, designed as a desktop, OEM version. It is extremely user friendly to use as an access control reader via USB or RS232 interface communicated with controllers at close quarters.
Adeneo Embedded announces Windows Embedded CE BSP for Gumstix Overo computer-on-module series
Adeneo Embedded presented today at TI Tech Days 2009 a preview of its new Windows Embedded CE 6.0 Board Support Package for the Gumstix Overo computer-onmodule series, which is based on Texas Instruments OMAP35x Applications Processors.
Ready-to-use Windows Embedded Compact 7 reference BSPs from Adeneo Embedded
Adeneo Embedded announced today the immediate availability of Windows Embedded Compact 7 reference Board Support Packages (BSPs).
Adeneo Embedded launches Windows Embedded Compact 7 support for TI’s OMAP 4 platform
Adeneo Embedded, a Microsoft Windows Embedded Gold Partner, which received the “Windows Embedded Excellence Award” by Microsoft from 2007 through 2010, announced a full suite of support services—including customized support, training and development service—tailored to assist original equipment manufacturers (OEMs) seeking to develop Windows Embedded Compact 7 on the OMAP™ 4 platform from Texas Instruments Incorporated (TI).
Adeneo announces Windows Embedded CE 6.0 reference BSP for the LPC3250
Adeneo, a Microsoft Windows Embedded Gold Partner with facilities in Europe and in the USA, today announced the full commercial release of the Windows Embedded CE 6.0 reference BSP for the LPC3250 ARM9 processor-based microcontroller from NXP Semiconductors targeting consumer, entertainment, industrial, medical and automotive industries.
Windows Embedded CE 6.0 BSP for Freescale i.MX25 Product Development Kit
Adeneo Embedded, a Microsoft Windows Embedded Gold Partner with facilities in Europe and in the USA, announced today the full commercial release of the Windows Embedded CE 6.0 Board Support Package (BSP) for Freescale’s i.MX25 Product Development Kit (PDK) applications processor based on the ARM9 core. This BSP targets the i.MX25 PDK, a standard development platform from Freescale. It supports key features of the i.MX25 PDK.
NEC selects Freescale communications processor for wireless infrastructure equipment
NEC Corporation has selected advanced embedded technology from Freescale Semiconductor for the newest generation of PASOLINK microwave communications equipment. NEC's PASOLINK products facilitate communication between a network’s core and intermediate network points such as wireless base stations. These “backhaul” links require equipment that delivers high levels of performance, flexibility and energy efficiency, as demand for content grows...
DENSO, Freescale and TRW join forces to form Distributed System Interface (DSI) Consortium
DENSO Corporation, Freescale Semiconductor and TRW Automotive Holdings Corp. have joined together to form an industry consortium to drive further development and deployment of the Distributed Systems Interface (DSI) standard.