Search results for "Infineon"

Security is becoming a major headache for IoT companies. Steve Rogerson looks at the risks.The dream of billions of connected devices comes with a security nightmare as even a small vulnerability in a cheap consumer device can lead to a massive problem. While most people are not that concerned about a minor hack on a connected fridge or kettle, the problem is what the hacker can do once connected.

The GaN and SiC Power Semiconductor Market is set to grow from its current market value of more than $400m to over $3bn by 2025; as reported in the latest study by Global Market Insights. The power semiconductor devices are witnessing high adoption for different power applications fuelling the growth of the GaN and SiC power semiconductor market.

A range of audio amplifier solutions which use pioneering multilevel switching technology to increase audio performance and reduce power loss during operation are available at Farnell. Infineon’s MERUS range of Class D audio amplifier solutions deliver extreme reliability and stability for the entire product lifetime.

Originally developed by and for the military, drones have grown far beyond the battlefield and are now used everywhere from oil fields to private farms. They are being used for delivering packages, surveying land and assisting in disaster relief. Their scope is becoming ever more varied and their parameters are broadening. By Mark Patrick, Mouser

Smartphone cameras increasingly require 3D vision capabilities as differentiating factor. Hence, Infineon Technologies developed the REAL3 IRS2381C, a premier 3D imager sensor solution especially designed for the mobile device market. The Embedded Vision Alliance now awarded the 3D Time-of-Flight (ToF) single chip solution as 'Product of the Year' in the category 'Sensors'.

Infineon Technologies enters high volume production of a comprehensive portfolio of 1,200V CoolSiC MOSFET devices. They are rated from 30-350mΩ and implemented into TO247-3 and TO247-4 housings. The expansion includes a surface mount device (SMD) portfolio and a 650V CoolSiC MOSFET product family, both to be launched soon.

Cutting-edge sensor technologies from leading suppliers is how Mouser Electronics describes its exhibit at the Sensors Expo and Conference 2019 in San Jose California (June 25-27). Mouser representatives will be at Booth 222 to discuss top technologies, new ideas, trends and emerging sensing solutions.

In order to support the automotive industry by building up a broad and cost competitive portfolio of hybrid and electric vehicles (xEV), Infineon Technologies is launching new power modules for xEV main inverters. At this year’s PCIM trade fair Infineon will present four new HybridPACK Drive modules optimised for different inverter performance levels between 100 and 200kW.

It has been announced that Infineon Technologies is extending the CoolSiC Schottky 1,200V G5 diode portfolio with the release of a TO247-2 package. It can easily replace silicon diodes for higher efficiency. The expanded 8.7mm creepage and clearance distances offer extra safety in high-pollution environments.

A new technology has been developed by Infineon Technologies and Schweizer Electronic, for the mild-hybridisation of cars; chip embedding for Power MOSFETs. It is set to significantly improve the performance of 48V systems while reducing their complexity. Continental Powertrain will be the first player to adopt the technology.