Search results for "6G"

Richardson RFPD now has a DC to 6GHz Envelope and TruPwr RMS (root mean square) Detector from Analog Devices(ADI). The device offers a high level of integration and functionality by combining two RF detector functions into one small chip, thereby simplifying designs and reducing BOM (bill of materials) cost.

Semtech have introduced a multi-standard silicon IP PHY that supports the latest new standards for high-speed wireline and wireless networks. The new SBMULTR2T2812G SiIP PHY is silicon-proven and was developed by Semtech’s Snowbush IP Group, which is focused on designing high-speed serial interface IP. The new platform supports JESD204B, Common Public Radio Interface and open base station architectural initiative. The IP also supports 10GBase-K...

Saelig now has a 3GHz Spectrum Analyser designed on a new generation platform to offer high stability, a large screen display, light weight and compact size. Its advanced Spectrogram and Topography features greatly expand the application range of this versatile RF analysis instrument. The 9kHz-3GHz GSP-930 provides high frequency stability (25ppb or 0.025ppm), and a very low noise floor of -142dBm (pre-amplifier on) for high-sensitivity measure...

Asset InterTech can now cover the entire debug to production test cycle on systems on a chip (SoCs) and circuit boards with the acquisition of Arium. The deal will see Arium’s software debug and trace capabilities integrated onto Asset InterTech’s ScanWorks platform by the end of this year.

DFI brings the Intel Xeon processor E3-1200 v3 series to the DL631-C226 ATX embedded motherboard. It is DFI’s first ATX board that supports the new Intel C226 Express Chipset. This ATX motherboard comes with LGA 1150 socket for the Intel Xeon processor E3-1200 v3 series built on 22-nanometer process technology that delivers up to 5~15% CPU performance increase over the previous generations.

Vecow has today introduced the ECS-7000-6F fan-less embedded controller, based on 3rd Gen Intel Quad-Core series processors (6M Cache, up to 3.30 GHz). The ECS-7000-6F features two Small Form Factor Pluggable fibre optics sockets, which are based on the Intel I350 chipset with optical fibre connectivity. This makes the embedded controller suited for bandwidth intensive, converged, and multi-protocol network communications.

LSI today announced it has expanded the LSI Nytro product portfolio of PCIe flash adapters with a new, high-capacity 3.2TB Nytro WarpDrive accelerator card, and expanded capacity, connectivity and software capabilities across the Nytro MegaRAID product family.

Advantech today announced the MIC-6311, its first OpenVPX compliant high performance, processing board based on the new dual and quad-core Intel Core series processors, bringing scalable performance improvements, greater power efficiency, and enhanced security to high performance embedded computing applications.

Super Micro Computer today announced the industry’s widest range of server solutions supporting Intel’s new Xeon Phi coprocessors this week in Leipzig, Germany at the 2013 International Supercomputing Conference.

DFI today launches the CR902-BL, a new Type of 2 COM Express basic form factor in its mobile Intel HM76 product line. This embedded module with BGA 1023 packaging technology supports the 3rd/2nd generation Intel Core/Celeron processor family, the next generation of 64-bit, multi-core processor featuring 22/32-nanometer process technology.