Search results for "photon chips"
Cadence Global Services Enables Industry's First TD-LTE Baseband Chip from Innofidei
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Innofidei Inc., a leading mobile chipset provider based in Beijing, China, has successfully taped out the industry’s first long-term evolution time division duplex (LTE-TDD, or TD-LTE) baseband chip supporting a bandwidth of 20MHz for the next-generation TD-CDMA wireless communications protocol. The TD-LTE design achieved first-pas...
Fujitsu Semiconductor Adopts Cadence Chip Planning System for MCU Chips at Its Design Centers Worldwide
Cadence Design Systems, Inc. today announced that Fujitsu Semiconductor Limited has adopted the newly updated Cadence Chip Planning System at its nine design centers spread around the globe. Fujitsu Semiconductor chose the Cadence system because of the time, accuracy and cost benefits it offers in the development of its MCU chips requiring large-scale integration (LSI).
Cadence Encounter Digital Implementation System 9.1 Addresses Industry Productivity Crisis for Complex System-on-Chip Design
Cadence Design Systems has released Cadence Encounter Digital Implementation (EDI) System 9.1, a complete and integrated digital design, implementation, and verification environment for the development of large-scale, complex SoCs. The new and expanded suite of capabilities in EDI System 9.1 answers the industry call for improved designer productivity in developing advanced low power and mixed signal SoCs at leading-edge process nodes – such as...
IMS CHIPS Standardizes on Cadence Silicon Realization Product Line for Advanced Gate Array Design
Cadence today announced that IMS CHIPS has adopted Cadence® Silicon Realization technologies for its special mixed-signal gate array technology. IMS CHIPS plans to deploy Cadence end-to-end Virtuoso® custom and Encounter® digital technologies for its commercial research business in areas such as advanced silicon technology, customer-specific circuits, nanopatterning and image sensor technology.
Cadence Collaborates with Samsung Foundry to Deliver Design-for-Manufacturing Solution for 32-, 28- and 20-Nanometer Chip Design
Cadence Design Systems, Inc. today announced that Samsung Electronics’ Foundry business, Samsung Foundry, has collaborated with Cadence to develop a world-class design-for-manufacturing (DFM) infrastructure to produce the most advanced chips. Working closely together, Cadence and Samsung Foundry have developed “in-design” and signoff DFM flows to tackle physical signoff and electrical variability optimization for 32-, 28- and 20-nanometer S...
Fairchild Semiconductor Selects Cadence as Primary EDA Partner
Cadence has announced that Fairchild Semiconductor, a leading global provider of energy-efficient semiconductor technology, has named Cadence as its primary EDA partner following the signing of a multi-year agreement for key Cadence mixed-signal technology.
ChipEstimate.com Announces New IP Partners
ChipEstimate.com announced today that more than two dozen IP companies recently have joined or upgraded their memberships to the ChipEstimate.com chip planning and IP portal. New members joining at the Prime Plus partner level include True Circuits, Inc., Virage Logic and Xilinx. New members joining at the Prime partner level are Alvand Technologies, Boeing, ChipStart, Evatronix, HDL Design House, Imagination Technologies, National Semiconductor...
Aerotech provides enabling positioning technology for nanometre precision direct-write laser application
One of the many varied and interesting research projects at the University of Southampton’s ORC (Optoelectronics Research Centre) involves direct UV laser writing of integrated optical circuits on specialised glass substrates and on its own patented ‘flat’ optical cable. With application potential from telecom network components through to lab-on-a-chip (LOC) biological and chemical sensors, the photonic circuits are produced wi...
ROBO-8111VG2AR PICMG 1.3 SHB Form Factor from Portwell
Portwell today unveils the Portwell ROBO-8111VG2AR full size PICMG 1.3 System Host Board which provides high performance graphics and flexible PCI Express expansion, ideal for a wide range of applications across several fields to include Factory Automation and Image Processing, as well as use in Kiosk, Medical, and Military equipment.
Design LED Products to collaborate in EU Light-Rolls manufacturing project
Design LED Products Ltd, is participating in the EU Light-Rolls project which is developing roll-to-roll printing processes for the manufacture of large area, flexible LED displays and lighting. Dr James Gourlay, technical director and founder of Design LED said, We are very excited by the possibilities that this type of manufacturing capability will offer to our products.