Search results for "photon chips"
Acrosser Technology Co. Ltd, global professional industrial embedded computer manufacturer, official announce new EPIC size embedded computer board
Acrosser Technology launched the AR-B5631 based on Intel GME965 chipset supports Intel Core 2 Duo / Core Duo / Celeron CPU and high-speed memory DDRII 533/667/800MHz SO-DIMM up to 2GB.
ACROSSER Announces New DM&P Votrex86DX ISA Half-Card
Acrosser Technology announces new ISA half-size embedded computer board: AR-B8170 based on DM&P Votrex86DX chipsets, on board 800MHz processor, on board 256MB DDRII-333MHz memory and 64MB video memory.
Model P730 Universal Fanout Buffer
Highland adds a multipurpose digital fanout buffer to its line of photonics products. As either a benchtop instrument or an OEM assembly, the P730 is compatible with CMOS, TTL, CMOS, LVDS, NECL, PECL, NIM and sine wave systems.
2nd Generation Intel Core CPU based Network Appliance delivers blazing fast network packet throughput for enterprise security applications.
“The Intel Q67 Express chipset allows for quicker packet throughput while using less energy,” said Terence Chou- Lanner’s Network Appliance Vice President. “When coupled with the 2nd Generation Intel Core processors, the chipset allows the FW-8770 to be our first mainstream appliance with 16 GbE LAN ports. The Intel processors also have new Intel Turbo Boost Technology 2.0 and power sharing enhancements which helps our appliance to have i...
Lanner Delivers Fanless Network Appliance with Six Network Ports and Intel Atom 1.6GHz Processor
Lanner Electronics, Inc., a leading designer and ODM of advanced platforms for network applications, today revealed the general availability of the FW-7530; a fan-less economic network appliance built around an Intel 945GSE chipset and Intel Atom processor with 6 GbE ports. The FW-7530 is ideal for any low level network applications.
CIP Technologies - Monolithically integrated reflective SOA-EAM for WDM and DWDM networks at ECOC
CIP Technologies, a company with a long history of photonics innovation, today announced the release of major new product, the R-SOA-EAM-1550, at the ECOC 2009 conference in Vienna, Austria. This novel device monolithically integrates a semiconductor optical amplifier with a reflective electro-absorption modulator, to combine high optical gain with high speed modulation capability. The R-SOA-EAM-1550 offers high output power, low power consumpti...
Siano Launches Integrated Receiver Chip for Latin America’s Emerging Digital TV Market
Siano Mobile Silicon (www.siano-ms.com), the leading supplier of digital mobile TV receiver chips, announced today the launch of a new product, targeting the digital TV markets of Latin America and Japan. The SMS2270 supports the ISDB-T high definition DTV technology, also known as ISDB-T “full-segment”.
NeoPhotonics Expands Portfolio of XFP Transceivers
NeoPhotonics announced today new CWDM and DWDM options in its XFP pluggable transceiver line to meet the growing need for high-speed “10 Gigabit” network connections such as OC192/STM-64, 10 G Fibre Channel, G.709, and 10 G Ethernet. Compliant with the XFP 10 Gigabit Small Form Factor Pluggable MSA Revision 4.5, NeoPhotonics’ expanded XFP line gives system designers flexibility in configuring their platforms for different network applicati...
Black Sand Technologies - First 3G CMOS RF Power Amplifier
Black Sand Technologies, Inc., a fabless semiconductor company specializing in advanced power amplifier technology for wireless applications, today announced that it has produced what it says is the world's first 3G CMOS RF Power Amplifier (PA). Black Sand's proprietary CMOS PA architecture offers a breakthrough in combined performance, cost, battery life, and reliability for mobile devices such as mobile phones and datacards. The company also ...
Lauterbach Pioneers 'Long Term Trace' Debug Technology
Lauterbach has announced that it has been pushing the barriers of debug technology with important developments in 'Long Term Trace' technology.