Search results for "ASIC"

The use of MCUs in automotive applications is growing, but Steve Rogerson found there were differences in how the chip makers see the market evolving.

A universal PMIC, which drives up to four independently controlled external DrMOS power stages at currents greater than 40A, has been released by Exar. Suitable for the latest 64-bit ARM processors, FPGAs, DSPs and ASICS, the XR77128 features the company’s programmable power technology, which allows for a low component count, rapid development, easy system integration, dynamic control and telemetry. To meet a wide range of output current re...

Initially focused on the military market, uncooled thermal camera sales have grown significantly due to cost reduction of micro bolometers and growing adoption in commercial markets. The market research and strategy consulting company, Yole Développement confirmed this growth last July, announcing +25% CAGR between 2014 and 2019 in its infrared imaging report, ‘Uncooled Infrared Imaging Technology & Market’.

Avago has demonstrated a 56Gb/s Pulse-Amplitude Modulation (PAM) 4 SerDes (Serialiser/Deserialiser) across copper backplanes and optical interconnects, targeting next-gen switches and routers. OEM customers are presently designing advanced ASIC SoC solutions in 28nm and 16FF+ process technologies, utilising the Avago PAM4 SerDes cores.

The recently released ANSYS 16.0 offers advanced functionality, from simulating theIoT's software/hardware interactions to better understanding advanced structural materials, enabling engineers to rapidly innovate products.ANSYS 16.0 advances the company’s entire portfolio, including structures, fluids, electronics and systems engineering solutions, allowing engineers to validate complete virtual prototypes.

The Leap On-Board-Transceiver (OBT) is a one inch square board mounted optical module which has been introduced by FCI. The device includes 12-transmit and 12-receive channels, each working at 25Gb/s over distances up to 100m with a total of 300Gb/s throughput. When placed near the host ASIC, the LEAP enables shorter copper board traces, better signal integrity and lower power consumption.

An IP macro, which meets the demands of IoT devices and Zettabyte traffic, has been successfully tested by Semtech. Operating at 25Gb/s and beyond, the snowPHY-C2 platform IP provides lane breakouts in 2x25G (for 50Gb/s), 4x25G (for 100Gb/s) and 8x25G (for 200Gb/s) form factors.

A dual 3A/single 6A step-down DC/DC power module, which simplifies power supply design for FPGAs, ASICs, MPUs and DSPs, has been introduced by Intersil. The ISL8203M measures 9.0x6.5x1.83mm and features an efficiency of 95%, providing power system designers with a high performance, easy to use solution for their low power, low voltage applications.

NEC has now begun the commercial production phase of its iPASOLINK microwave communication equipment for mobile networks, which utilises Toshiba’s FFSA (Fit Fast Structured Array) custom LSI solution. Toshiba’s solution, which employs licensed technology from BaySand, meets NEC's performance, power and time-to-market requirements.

At Embedded World 2015, which takes place from 24th to 26th February, Toshiba Electronics Europe will be showcasing technologies from across its wide range of standard and custom semiconductor solutions. Various application processors from the company’s ApPLite range will be demonstrated at the show. These application processors support secure communication and provide timely processing of text, sound, image and sensor data.