Search results for "semiconductor"
Lattice introduces new secure control FPGA family
Lattice Semiconductor has announced the Lattice MachXO5D-NX family of advanced secure control FPGAs, offering crypto-agile algorithms, hardware root of trust features with integrated flash, and fail-safe remote field updates for reliable and secure product lifecycle management.
Silanna Semiconductor at APEC 2024
Silanna Semiconductor has announced that it will showcase its full portfolio of AC/DC and DC/DC products that offer leading power density, efficiency and performance at the upcoming Applied Power Electronics Conference (APEC) 2024.
ASMPT showcased power module solutions at PCIM
At the PCIM Europe event in Nuremberg, ASMPT showcased a comprehensive power module manufacturing solution.
GOWIN offers new low-cost option for video display
GOWIN Semiconductor, a fast-growing FPGA manufacturer, has introduced the GW5AT-15 FPGA, designed to deliver a high-speed programmable bridging solution for demanding consumer electronics and automotive applications, such as 4K video transfer at frame rates up to 120 frames per second.
Low-power 46 GOPs MCU comes in compact footprint
Alif Semiconductor launched the Ensemble E1C, a microcontroller (MCU) series that combines rich digital and analog capabilities with a low-power on-chip neural processing unit (NPU) in a new compact form factor.
Navitas’ Gen-3 Fast SiC MOSFETs accelerate next-gen AI growth & EV charging
Navitas Semiconductor has announced its new portfolio of Gen-3 ‘Fast’ (G3F) 650 V and 1,200 V SiC MOSFETs optimised for the fastest switching speed, highest efficiency, and increased power density for applications such as AI data centre power supplies, on-board chargers (OBCs), fast EV roadside super-chargers, and solar / energy-storage systems (ESS).
Empower Semiconductor to present at Chiplet Summit 2024
Empower Semiconductor, a specialist in integrated voltage regulators (IVRs), is set to present a technical paper at the forthcomingChiplet Summit, scheduled at the Santa Clara Convention Centre from 6-8thFebruary 2024.
ROHM’s new TRCDRIVE pack with 2-in-1 SiC moulded module
ROHM has developed four models as part of the TRCDRIVE pack series with 2-in-1 SiC moulded modules (two 750V-rated: BSTxxxD08P4A1x4, and two 1,200V-rated: BSTxxxD12P4A1x1) optimised for electric vehicle (xEV) traction inverters.
ROHM's new EcoSiC brand combines performance and sustainability
ROHM has announced the launch of its new EcoSiC brand. EcoSiC is a trademark for ROHM products using the advanced material silicon carbide (SiC).
Why FPGAs are critical to navigating evolving security requirements
The cyber threat landscape is showing no signs of slowing down. As cybercriminals develop more sophisticated techniques and target a wider range of organisations, traditional security measures are becoming increasingly insufficient – and costly.