Search results for "optical computing"
HPC customer engages Sondrel for high end chip design
Sondrel has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.
Rand Technology at electronica 2024
At electronica 2024, Rand Technology’s CEO, Andrea Klein spoke with Electronic Specifier’s Editor, Mick Elliot, about the need for modernised supply chains, addressing the challenges involved, and Rand Technology’s participation.
Blueshift Memory launches the new BlueFive processor
Blueshift Memory has announced the availability of a RISC-V processor reference design that addresses the twin problems facing today’s computing industry: the Memory Wall and the Energy Wall.
Capacitive bubble sensors: cost effective air bubble detection
In many industrial applications, it is important to precisely monitor the constant flow of liquids. Undesired air bubbles in the liquid stream are problematic because they can negatively influence processes or cause damage. EBE sensors + motion offers a new solution for this with the capaTEC technology.
Supermicro delivers direct-liquid-optimised NVIDIA Blackwell solutions
Supermicro has announced the highest-performing SuperCluster, an end-to-end AI data centre solution featuring the NVIDIA Blackwell platform for the era of trillion-parameter-scale generative AI.
Hybrid bonding for data highways
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical andelectronic componentsare integrated in a common housing.
Infineon and Quantinuum announce partnership
Infineon and Quantinuum have announced a strategic partnership to develop the future generation of ion traps.
Teledyne e2v now sampling arm based LX2160-space engineering models
Teledyne e2v announced engineering models of the LX2160-Space 16-core Arm Cortex A72 based system on chip (SoC) processor, enabling early project design, hardware and software validation for space-demanding applications. LX2160-Space engineering models have the same fit/form/function as flight models (FMs).
Nano Dimension new 3D printer for micro applications at Formnext
Nano Dimension has announced the launch of its Exa 250vx Digital Light Processing (DLP) 3D Printer for micro applications.
Teledyne e2v samples Arm-based LX2160-Space models
Teledyne e2v announces engineering models of the LX2160-Space 16-core Arm Cortex A72 based system on chip (SoC) processor, enabling early project design, hardware, and software validation for space-demanding applications. LX2160-Space engineering models have the same fit/form/function as flight models (FMs).