Search results for "nexperia"

Electronic Specifier takes a look at the top power products to have been released in November 2022.

EBV Elektronik will exhibit at embedded world from 14th to 16th March 2023 in Nuremberg, Germany

NexperiaNextPower 80/100V MOSFETs are recommended for high-efficiency switching and high-reliability applications. The NextPower MOSFETs feature 50% lower RDS(on)and a strong avalanche energy rating. The devices are ideally suited for power supply, telecom, industrial designs, USB-PD Type-C chargers and adapters, and 48V DC-DC adapters

Drawing on decades of expertise as an industry leader in the production of discrete components, Nexperia introduces the ultra-small DFN0603 package. Measuring only 0.63 x 0.33 x 0.25 mm, using 13% less space, with a 74% reduction in RDS(on) than the next smallest MOSFET package in the market (DFN0604). Helping to improve efficiency and thereby enabling end equipment designers to achieve greater power density.

Semiconductor manufacturers worldwide are estimated to increase 200mm fab capacity 20% from 2021 through 2025, adding 13 new 200mm lines as the industry reaches a record high of more than seven million wafers per month (wpm), SEMI announced in its 200mm Fab Outlook to 2025 report.

Nexperia’s Diode Application Handbook is a unique collection of technical materials and application examples. Providing useful guidance on topics and issues that the design engineer is likely to encounter, as diodes remain a very important component of electronic systems. Written by engineers for engineers this reference work represents the collected knowledge of some of our industry’s most respected experts.

Nexperia has announced the release of 14 rectifiers for power applications in its new CFP2-HP (Clip-Bonded FlatPower) packaging. Available in standard and AECQ-101 versions, these include 45 V, 60 V and 100 V Trench Schottky rectifiers (with 1 and 2 A options) including the PMEG100T20ELXD-Q, a 100 V, 2 A Trench Schottky barrier rectifier.

Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags

Nexperia and KYOCERA AVX components salzburg agree partnership for gallium nitride automotive power modules.

The increasing number of electronic functions in modern cars must be realized within a given space necessitating components to shrink in size. However, smaller packages need to dissipate the same amount of heat on a reduced footprint, leading to a higher power density on the board. DFN packages with their compact dimensions and thermal properties are the right choice.