Search results for "e-con systems"

Blueshift Memory has announced the availability of a RISC-V processor reference design that addresses the twin problems facing today’s computing industry: the Memory Wall and the Energy Wall.

Advantech has announced that the MIC-732-AO, UNO-148 V2, MIC-770 V3 + MIC-75GF10, and IPC-730 have each received a 2024 IoT Edge Computing Excellence Award from IoT Evolution World.

Winbond Electronics, a global supplier of semiconductor memory solutions, announces the enhanced LPDDR4/4X DRAM products, specifically designed for the latest generation of automotive applications. These solutions offer significant advancements in power efficiency, performance, and carbon reduction.

The London Climate Technology Show 2024 is just five days away, as industry experts, business leaders, and influential decision-makers converge at ExCel London to chart the course towards a net-zero future.

TactoTek, the global In-Mould Structural Electronics (IMSE) technology pioneer, has announced the completion of a $60 million funding round led by Nidoco AB, part of Virala Group. The financing attracted significant investments from a premier consortium of financial and strategic investors including Cornes Technologies, Elo Mutual Pension Insurance Company, European Investment Bank, Finnish Industry Investment Ltd, 3M Ventures, Ingman Group, VTT ...

Fairview Microwave, an Infinite Electronics brand, has announced the launch of its new spring-loaded adapters for the SMP, SMPM and SMPS connector series.

Emproof and DDC-I, a trusted provider of safety-critical real-time operating systems, have announced a strategic partnership.

Siemens Digital Industries Software announced its ongoing collaboration with Infineon to combine Siemens embeddedautomotive software platform, based on the AUTOSAR Classic platform R20-11, with Infineon’s AURIX TC4x microcontroller.

Supermicro has announced the highest-performing SuperCluster, an end-to-end AI data centre solution featuring the NVIDIA Blackwell platform for the era of trillion-parameter-scale generative AI.

The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical andelectronic componentsare integrated in a common housing.