Search results for "ai safety summit"
Get ready for SEMICON Europa 2024
SEMICON Europa 2024 will gather industry experts November 12-15 at Messe München in Munich, Germany for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management and workforce.
TI to showcase sustainability and intelligence at electronica 2024
Texas Instruments (TI) will demonstrate new embedded processing and analog products for designing a more intelligent and sustainable future at electronica, Nov. 12-15 in Munich, Germany.
Plextek: the role of custom RF system design
With the mining industry at a pivotal point, facing unique issues that demand advanced technology solutions to enhance safety and operational efficiency, technology development specialist Plextek has released advice that will help the sector to meet these new challenges.
Mira Murati departs OpenAI: a leadership shift amid corporate restructuring
Mira Murati, OpenAI’s Chief Technology Officer, has resigned after six and a half years, marking the end of a critical period for the company.
DSIT bolsters leadership team to drive UK science and tech
Experts in health, law, risk management and marketing have been appointed to oversee the Department for Science, Innovation and Technology’s (DSIT) work to transform the UK into a science and technology superpower, bolstering the DSIT board with a series of key leadership figures.
Future fusion maintenance with autonomous robot
Afully autonomous robothas been deployed to inspect the interior of a fusion energy facility, marking a world-first achievement in robotics and energy research.
How to solve data integrity challenges for frictionless retail stores
As retailers face falling profits, rising costs, and staffing challenges, many are turning to technology to enhance efficiency and reduce workforce numbers on the shop floor.
Cadence Tensilica HiFi 5 DSPs used in NXP’s audio DSP family
Cadence's Tensilica HiFi 5 Digital Signal Processors (DSPs) have been integrated intoNXP Semiconductors' latest automotive audio DSP family.
Cron AI and Lumotive unveil AI-powered solid-state LiDAR
Cron AI and Lumotive have announced the next generation of 3D sensor technology: a solid-state LiDAR design with integrated deep learning capabilities, utilising Lumotive's Light Control Metasurface (LCM) chip for enhanced 3D sensing.
MEMS & Imaging Sensors Summit
TheSEMI MEMSand Imaging Sensors Summit, themed‘Sensor Revolution for a Connected Future,’ will gather top sensor technology experts on 14th November 2024 at the International Conference Centre Munich (ICM), Germany. Registration is now open.