Search results for "XP Power"

Richardson Electronics, Ltd. and Navitas Semiconductor announced an expanded distribution partnership for next-gen silicon carbide (SiC)power semiconductorsfor Europe, the Middle East, and Africa (EMEA).

ST has introduced an IO-Link reference design for industrial beacons and home-appliance alarms, delivered ready-to-use as a fully built board complete with protocol stack and application software.

Power componentsare evolving to meet the increasing demands for higher efficiency, smaller size and greater performance in power electronic systems. To provide system designers with a wide range of power solutions, Microchip Technology announces its portfolio of IGBT 7 devices offered in different packages, multiple topologies, and current and voltage ranges.

IQD has announced the release of a new miniature OCXO in their range of enhanced performance oscillators: IQOV-116, at electronica, Munich, November 12–15, Hall A6, Würth Elektronik Booth 502.

To enable system engineers in the EV industry to take the next step towards transformer-less on-board chargers (OBCs), LEM has designed the first automotive grade residual current monitoring (RCM) type B sensor for bi-directional OBCs with ASIL B capabilities.

Ignion has announced a three-port Virtual Antenna component to support simultaneous cellular, GNSS, and Wi-Fi/BLE radios.

Nordic Semiconductor launches its nRF54L Series ofwireless SoCs, including the previously announced nRF54L15, and the new nRF54L10 and nRF54L05.

ScioSense has launched a two-channel time-to-digital converter (TDC) which offers the very high time measurement resolution and high output data rate required in LiDAR systems.

u-blox announces the launch of the MAYA-W4, a cost-efficient tri-radio module that delivers the latest inwireless connectivitytechnologies for the mass market.

Electronic Specifier highlights the top 10 stories fromelectronica 2024, the world’s leading trade fair for electronics.