Search results for "Specialty Coating Systems"
Elevate embedded security with Deos and Emproof Nyx
Emproof and DDC-I, a trusted provider of safety-critical real-time operating systems, have announced a strategic partnership.
Infineon and Siemens collaborate on software-defined vehicles
Siemens Digital Industries Software announced its ongoing collaboration with Infineon to combine Siemens embeddedautomotive software platform, based on the AUTOSAR Classic platform R20-11, with Infineon’s AURIX TC4x microcontroller.
Supermicro delivers direct-liquid-optimised NVIDIA Blackwell solutions
Supermicro has announced the highest-performing SuperCluster, an end-to-end AI data centre solution featuring the NVIDIA Blackwell platform for the era of trillion-parameter-scale generative AI.
Hybrid bonding for data highways
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical andelectronic componentsare integrated in a common housing.
Bourns increases Riedon power resistor line with 11 product series
Bourns has announced it has increased its line of Riedon Power Resistors with the release of 11 product series.
Infineon and Quantinuum announce partnership
Infineon and Quantinuum have announced a strategic partnership to develop the future generation of ion traps.
Teledyne e2v now sampling arm based LX2160-space engineering models
Teledyne e2v announced engineering models of the LX2160-Space 16-core Arm Cortex A72 based system on chip (SoC) processor, enabling early project design, hardware and software validation for space-demanding applications. LX2160-Space engineering models have the same fit/form/function as flight models (FMs).
Siemens EDA at electronica 2024 with Electronic Specifier
Siemens EDA debuted its next generation AI-enhanced Electronic Systems Design software at electronica. Ed Goldman, Director of Program Management describes how it simplifies complex PCB design processes, reduces learning curves, and accelerates time-to-productivity.
Teledyne e2v samples Arm-based LX2160-Space models
Teledyne e2v announces engineering models of the LX2160-Space 16-core Arm Cortex A72 based system on chip (SoC) processor, enabling early project design, hardware, and software validation for space-demanding applications. LX2160-Space engineering models have the same fit/form/function as flight models (FMs).
Microchip to accelerate real-time Edge AI with NVIDIA Holoscan
To enable developers building artificial intelligence (AI)-driven sensor processing systems, Microchip Technology has released its PolarFire FPGA Ethernet Sensor Bridge that works with the NVIDIA Holoscan sensor processing platform.