Search results for "SEMICON Europa"

u-blox announces the launch of the MAYA-W4, a cost-efficient tri-radio module that delivers the latest inwireless connectivitytechnologies for the mass market.

SECO S.p.A. and NXP Semiconductors announce a significant milestone in their partnership: SECO’s Clea software platform will be available to all NXP silicon users and seamlessly integrated with NXP’s EdgeLock 2GO service platform.

Cambridge GaN Devices (CGD) and Qorvo have partnered to bring together motor control and power efficiency technologies in the PAC5556A + ICeGaN evaluation kit (EVK).

At electronica 2024, on the DigiKey booth, Caitlin Gittins speaks with Alex Lidow, CEO, EPC about GaN and the future of untethered robots.

ROHM has developed surface mount SiC Schottky barrier diodes (SBDs) that improve insulation resistance by increasing the creepage distance between terminals.

At electronica 2024, X-FAB announced its latest collaboration with SMART Photonics to drive photonics innovations within datacom, telecom and beyond.

New Source Management Unit (SMU) module for the M81-SSM instrument platform brings laboratory-grade, low-level measurement capabilities to a benchtop instrument.

LASER COMPONENTS has announced its range of VCSELs for a variety of applications.

Texas Instruments (TI) has announced the opening of its new, state-of-the-art product distribution centre in Dreieich, Germany, outside of Frankfurt.

Toshiba has developed new 1200V silicon carbide (SiC) MOSFETs with low on-resistance (RDS(ON)) and high levels of reliability.