Search results for "Nordson"
New products prepare for Advanced Engineering UK launch
Nordson EFD is introducing its xQR41 Series MicroDotneedle valve at the Advanced Engineering UK event at the NEC, Birmingham (November 4-5). This new valve features a 60% smaller form factor in comparison to standard valves, an exchangeable modular design and a unique quick release clasp.
Nordson to exhibit at SMTA International
Nordson DAGE and Nordson YESTECH, divisions of Nordson, will exhibit in booth 606 at SMTA International, scheduled to take place from 19th to 20th September 2015 at the Donald Stephens Convention Center in Rosemont, IL. Nordson’s team of test and inspection experts will demonstrate the XD7600NT Diamond FP X-ray inspection system from Nordson DAGE and FX-940 AOI In-line PCB inspection system from Nordson YESTECH.
Nordson to feature test and inspection systems at SMTA experience
Nordson DAGE and Nordson YESTECH, divisions of Nordson, are pleased to announce that their products will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from 29th to 30th September 2015 on the show floor of SMTAI. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.
Cartridge comes in two pieces for easy cleaning
Nordson ASYMTEK introduces the NexJet NJ-8 system, which improves and simplifies the dispensing process for fast-paced production environments where precision, flexibility, and long-term reliability are important. The NJ-8's ReadiSet two piece jet cartridge is quickly and easily removed, cleaned, inspected and re-installed without tools, maximising equipment utilisation and up-time.
Piezoelectric jetting technology combines speed & accuracy
Nordson EFD hasintroduced piezoelectric jetting technology that removes the barrier between speed and accuracy. EFD's PICOPµlsevalve and PICOToµchcontroller make it possible to dispense very exact, repeatable micro-deposits as small as 0.5nL at up to 500Hz continuous, with 1500Hz maximum bursts - an industry best.
Plasma treatment system expands up to six chambers
Nordson MARCH announces that its StratoSPHERE Series plasma treatment equipment for wafer-level packaging and 3D packaging applications can now be configured in two, four, and even six chamber configurations for increased throughput and flexibility.
Dispenser uses five axes of automated control
The Programmable Tilt + Rotate 5-Axis Fluid Dispenser, which dispenses fluid using five axes of automated control instead of only three, has been released by Nordson ASYMTEK.
Plasma systems for wafer-level and 3D packaging applications
Nordson MARCH announces its recent SPHERE series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAK Series, the series consists of the TrophoSPHERE and StratoSPHERE plasma treatment systems. The systems perform descum, ashing (photoresist/polymer stripping), dielectric etch, wafer bumping, organic contamination removal and wafer destress.
MicroDot needle valve is 60% smaller than standard
Featuring a 60% smaller form factor than standard valves, the xQR41 series MicroDot needle valve has been introduced by Nordson EFD. It includes an exchangeable modular design for greater customisation and process control and a Quick Release (QR) clasp that allows easy removal of the fluid body to replace wetted parts in seconds.
Wafer testing technology on display at SEMICON West 2015
At SEMICON West 2015, which takes place from 14th to 16th July at the Moscone Center in San Francisco, Nordson DAGE will exhibit in booth 5744. Here, the company will present the 4800 wafer level Bondtester for the first time in North America.