Search results for "photon chips"
Mirics and Spreadtrum announce availability of embedded CMMB PCTV solution
Further to the strategic partnership announced in December 2008 between Mirics Semiconductor and Spreadtrum Communications, the two companies today announce the availability of an embedded PCTV solution that supports the China Multimedia Mobile Broadcasting (CMMB) mobile digital TV standard. Mirics will demonstrate the solution receiving live CMMB broadcasts on a standard netbook PC at the Intel Developers Forum in Beijing on April 8, 2009.
ARM announces 45nm SOI Test Chip Results Demonstrating 40 Percent Power Saving Potential
ARM announced at the IEEE SOI Conference, Foster City, Calif., the results from a silicon-on-insulator (SOI) 45nm test chip that demonstrate potential power savings of up to 40 percent over traditional bulk process for manufacturing chips. The test chip was based on an ARM 1176™ processor and enables a direct comparison between SOI and bulk microprocessor implementations. The results confirm SOI technology is a viable alternative to traditiona...
European Research Project BioP@ss to Enhance Chip Card Security Paves the Way for Electronic ID Cards with EU-Wide Validity
Chip manufacturers Infineon Technologies AG and NXP Semiconductors Germany GmbH and chip card maker Giesecke & Devrient GmbH are among the eleven companies from six European Union countries participating in the European research project BioP@ss to develop a high-security chip card platform.
NXP and Trusted Logic partner to drive NFC middleware integration
NXP and Trusted Logic today announced a partnership in which Trusted Logic will distribute and market the NFC middleware, which embeds the NXP Reference Implementation. This agreement will accelerate NFC deployment, with a faster time to market and skilled resources to support NFC middleware integration into NFC-enabled wireless devices.
NXP and Giesecke & Devrient Launch Contactless Fast Pay Solution
NXP and Giesecke & Devrient (G&D), a leading supplier of payment cards, services, and smart card solutions, today announced the introduction of NXP’s new Fast Pay contactless security chip and a new line of G&D contactless payment devices based on this IC. Fast Pay-based devices have been specifically designed to provide consumers in the USA and Canada with a convenient and swift contactless payment solution – replacing the need for cash and ...
NXP MIFARE Plus Scores High in Independent Security Reviews
NXP Semiconductors today announced that its MIFARE Plus contactless smart card CPU IC (MF1PLUSx0y1) has been awarded Common Criteria EAL 4+ certification by the German Federal Office for Information Security (Ref.: BSI-DSZ-CC-0586-2009). In addition, MIFARE Plus has proven successful in independent security reviews conducted by leading cryptography experts from the Ruhr-Universität in Germany and the Katholieke Universiteit Leuven in Belgium, wh...
NXP Brings Smart Card Security to Device Authentication
NXP Semiconductors announced the au10tic family of secure ICs designed specifically for device authentication. The au10tic secure microcontrollers are based on NXP's proven security technology, which has been widely used for securing government ID cards and passports, as well as smart cards for banking and other high-security applications. Offering easy integration into end devices, the NXP au10tic ICs provide a complete tamper-resistant securit...
ZTE and NXP Announce NFC Availability in Next Generation Handsets
NXP and ZTE Corporation, (H share stock code: 0763.HK / A share stock code: 000063.SZ), a leading global provider of telecommunications equipment and network solutions, today announced a partnership to incorporate NXP’s Near Field Communications (NFC) PN544 technology into ZTE handsets. ZTE plans to include NFC chips into its rapidly expanding line of global smartphones and feature phones, such as the Android-based QSC6270 platform devices as w...
ZMD AG to sponsor, exhibit smart power management devices at APEC 2012
ZMD AG (ZMDI) will sponsor and exhibit at the Applied Power Electronics Conference & Exposition, to be held February 5 – 9, 2012 in Orlando, Florida. ZMDI will display two product lines designed to address specific application needs ranging from mobile devices to high-end systems, such as servers and storage units.
ASSET ScanWorks named Best in Test finalist for high-speed memory bus validation toolkit
The ScanWorks platform for embedded instruments from ASSET InterTech has been honored by Test and Measurement World magazine by being named a finalist in the 2011 Best in Test awards. ASSET (www.asset-intertech.com) is the leading supplier of open tools for embedded instrumentation.