Search results for "OEM"
AMD Embedded G-Series Platform Now Supports Windows Embedded Compact 7 Real-Time Operating System
AMD today announced that its AMD Embedded G-Series platform now supports Windows Embedded Compact 7, the next generation of the Windows Embedded CE real-time operating system. Windows Embedded Compact 7, paired with AMD Embedded G-Series Accelerated Processing Units (APU) is optimized to deliver feature-rich applications on small, specialized devices for industries such as medical, retail and industrial automation.
Second-Generation AMD A-Series APUs Enable Best-in-Class PC Mobility, Entertainment, and Gaming Experience in Single Chip
AMD today announced the widely anticipated launch of its 2nd-Generation AMD A-Series Accelerated Processing Units for mainstream and ultrathin notebooks, All-in-One and traditional desktops, home theater PCs and embedded designs.
New Reflow Oven Introduced by APS Novastar
APS Novastar (http://www.apsgold.com) announces the introduction of the ERO-500 Reflow Soldering System. The addition of the ERO-500 reflow oven fills out the mid-range of APS Novastar's reflow product line, providing its customer base with a cost-effective conveyor reflow oven with five (5) vertical heating zones and one (1) cooling zone. The ERO-500 has been developed for small to medium volume reflow soldering of SMT boards, hybrid boards, a...
Sleek 3D Mobile Phone Designs Collaboration with Touch Screen Leader Delivers OEM Benefits of Design Freedom, Supply Chain Optimization and System Cost
Jabil Circuit, Inc. today announced a revolutionary new technology to seamlessly integrate touch screens into molded plastic cover lenses for greatly improved 3D mobile phone designs. This new integrated touch screen solution is the result of the close collaboration and co-development work between Jabil | Green Point, Jabil’s Mobility sector group, and JTouch, one of the top five touch screen manufacturers in the world. Using proprietary ultrav...
MPC Data Brings Support for High Reliability Flash File systems to Texas Instruments DM355 Windows CE6.0 R3 BSP
MPC Data have joined forces with Datalight Inc to announce the latest release of the Windows Embedded CE 6.0 R3 Board Support Package (BSP) for the Texas Instruments TMS320DM355 Digital Video Evaluation Module. This BSP targets the DM355 EVM and integrates the high reliability and industry leading, high performance flash management solutions from Datalight Inc.
MindTree’s IEEE-11073 Stack for Connected Health Applications Achieves Continua® Health Alliance Certification
MindTree has announced that it has attained Continua Health Alliance’s certification for its EtherMindTM IEEE-11073 Stack (Certification IDs 38 and 39) for connected health applications. The Continua-certified EtherMind IEEE-11073 stack is now available for licensing, enabling a quick and low-cost path for medical tablet and sensor device OEMs to build standards-based, and interoperable health systems over Personal Area Networks (PAN) or Local ...
MindTree Unveils Bluetooth Solutions Suite for In-car Health Applications
Brings wireless health monitoring into the car through full-featured, interoperable and easily integrable Bluetooth dual mode IP suite Global IT and product engineering services company MindTree, a leading provider of licensable Bluetooth intellectual property (IP), has unveiled a portfolio of its EtherMindTM Bluetooth 4.0 dual-mode (includes both Classic and Low Energy) solutions. This offers the recently adopted Health Thermometer Bluetooth Lo...
Broadcom Completes World's First Microsoft Mediaroom Client Integration With New Embedded Wireless High Definition Set-Top Box Solution
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that its Broadcom® BCM4717V wireless system-on-a-chip (SoC) solution is the world's first to complete the Microsoft® Mediaroom™ wireless client integration inside a high definition (HD) set-top box (STB).
Broadcom Enables Massive Network Scalability with World's Highest Density 100GbE Switch Solution
Broadcom Corporation today introduced the BCM88650 series, the world's highest density 100 gigabit Ethernet (GbE) switching solution, enabling the design of switching platforms with densities up to 4,000 100GbE ports. With the industry's highest level of integration, the BCM88650 system on chip (SoC) combines the features and functionality of a complete line card into a single chip.
Broadcom Expands Bandwidth for 4G Mobile Backhaul with Latest High Performance Switching Silicon
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced its latest StrataXGS® BCM56440 switch series, developed specifically to address the economic and performance challenges of service providers as they upgrade legacy mobile networks to manage the exponential growth in wireless data traffic and transition to 4G.