Search results for "microelectronics"
David Burrows appointed Chair of NMI
Dr. David Burrows has been announced as the new Chair of the National Microelectronics Institute (NMI), the trade association representing the interests of the semiconductor industry in the UK and Ireland. The appointment was announced by CEO Derek Boyd at the NMI’s Annual General Meeting in London.
Board appointments mirror UK design prowess
The National Microelectronics Institute (NMI), the trade association representing the semiconductor industry in the UK and Ireland, has announced the appointment of two new board directors; Dr Hossein Yassaie, CEO of Imagination Technologies and Ivor Evans, VP of Product Engineering at Cambridge Silicon Radio (CSR).
Rogers Corporation to Present Practical Materials Solutions at IMAPS Device Packaging 2010
Rogers Corporation will showcase three of its advanced materials for microelectronics packaging at this year’s International Microelectronics and Packaging Society (IMAPS) Device Packaging 2010 event (March 9-10, 2010, Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, AZ). Rogers Corporation to Present Practical Materials Solutions at IMAPS Device Packaging 2010
Peregrine Semiconductor développe avec IBM Microelectronics un processus de nouvelle génération pour les semi-conducteurs CMOS RF
Peregrine Semiconductor Corporation, fournisseur important de circuits intégrés RF CMOS de haute performance, annonce ce jour un accord de développement commun et exclusif avec IBM portant sur le développement et la fabrication des générations futures d’UltraCMOS™ basés sur la technologie de processus breveté silicium sur saphir (SOS) de Peregrine, le processus de fabrication RF ...
Microsemi Delivers Complete, Space-saving SATA Storage Systems for Secure Defence and Aerospace Applications
Microsemi Corporation launched the first in a family of complete SATA storage systems for secure embedded defense applications. The compact MSM37 and MSM75 solutions are each packaged as a single 32mm x 28mm 522 PBGA (plastic ball grid array) and provide up to 75 gigabytes (GB) of NAND flash solid state storage. The combination of these features makes the devices ideal for applications where a full-size 2.5 inch storage device is too large
Order for a Compact 21 research system in Russia
RIBER is announcing the sale of a Compact21 research system to the Russian Academy of Sciences, Saint Petersburg.
STI Electronics, Inc. Continues Growth with Record Sales in 2011
STI Electronics, Inc., announces its most successful year to date. “Thank you to all of our customers and staff members for your continued support in 2011. Financially, STI had our best year ever and we are looking forward to an even stronger 2012 as we approach our 30th year serving our customers and our industry,” commented David Raby, President & CEO of STI Electronics.
Sigurd Corporation Chooses Multitest’s MT2168
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, congratulates Sigurd Microelectronics Corporation (Sigurd) for being the first user of the innovative MT2168 pick-and-place handler in volume production in Taiwan.
Balver Zinn/Cobar Group Sponsor the Pan Pacific Microelectronics Symposium
The Balver Zinn/Cobar Group announces that they will sponsor the SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii. The companies also will sponsor the golf tournament during the symposium.
Harris Corporation and Tektronix Component Solutions Establish Strategic Partnership Agreement
International communications and information technology company Harris Corporation and Tektronix Component Solutions have announced the strengthening of their long-standing relationship via the establishment of a strategic partnership agreement.