Search results for "generative ai"

Dr Arogyaswami J Paulraj, Emeritus Professor at Stanford University and Senior Advisor for deeptech venture capital firm Celesta Capital, has been honoured with the Royal Academy of Engineering’s Prince Philip Medal.

Honeywell has announced the launch of its Battery Manufacturing Excellence Platform (Battery MXP), an AI-powered software solution designed to optimise gigafactory operations from the outset.

Are you interested in learning how to optimise your AI infrastructure to support faster, more efficient, and more affordable AI and ML deployments? Your peers including Apple, AWS, Google, Natwest, Mercedes, Nokia and more have signed up to attend the AI Hardware & Edge AI Summit Europe (June 18-19 at the etc.venues, London), make sure you're there to join them.

Alphawave Semi has expanded its strategic partnership with Samsung Foundry. The expanded agreement encompasses leading-edge IP for PCI Express 7.0, 112G and 224G Ethernet and the latest UCIe (Universal Chiplet Interconnect Express) die-to-die interconnect standard that is enabling next-generation SoC (system-on-chip) technologies for AI and other HPC systems.

Leapmotor and Ambarella, Inc. have recently signed a strategic cooperation agreement. The two companies aim to create a first-class intelligent driving experience for the global new energy vehicle market.

At the Digital Enterprise Show (DES) in Malaga, industry leaders gathered to discuss the future of immersive technologies, exploring how virtual reality (VR), augmented reality (AR), spatial computing, digital twins, haptic feedback systems, artificial intelligence (AI), and blockchain integration are ready and waiting to shake-up the tech landscape.

Infineon Technologies introduces Power System Reliability Modelling, a solution designed to address the increasing challenges faced by data centres and telecom infrastructures due to power supply failures.

Cambridge GaN Devices (CGD) has launched its lowest ever on-resistance (RDS(on)) parts.

Viavi Solutions Inc. announces its participation in the IEEE International Communications Conference in Denver, Colorado, where it will present research, solutions, and perspectives on next-generation networking technologies, including 6G, AI, Open RAN (O-RAN), and Non-Terrestrial Networks (NTNs).

Infineon Technologies will provide customers with comprehensive Product Carbon Footprint (PCF) data.